片上系统互连串扰的故障建模与仿真

M. Cuviello, S. Dey, Xiaoliang Bai, Yi Zhao
{"title":"片上系统互连串扰的故障建模与仿真","authors":"M. Cuviello, S. Dey, Xiaoliang Bai, Yi Zhao","doi":"10.1109/ICCAD.1999.810665","DOIUrl":null,"url":null,"abstract":"System-on-chips (SOCs) using ultra deep sub-micron (DSM) technologies and GHz clock frequencies have been predicted by the 1997 SIA Road Map. Recent studies, as well as experiments reported in this paper, show significant crosstalk effects in long on-chip interconnects of GHz DSM chips. Recognizing the importance of high-speed, reliable interconnects in GHz SOCs, we address in this paper the problem of testing for glitch and delay errors caused by crosstalk in buses and interconnects between components of a SOC. Since it is not possible to explicitly test for all the possible process variations and defects that can lead to crosstalk errors in SOC interconnects, we present an abstract model, Maximum Aggressor (MA) fault model, and its test requirements. The attractiveness of the model is that it can abstract crosstalk defects in interconnects with a linear number of faults, while the corresponding MA tests provide complete coverage for all level defects related to cross-coupling capacitance the interconnects. A SPICE-level fault simulation methodology is presented which allows simulation of a small subset of the potentially exponential number of defects. The simulation methodology also enables validation of the proposed fault model and the resulting test set.","PeriodicalId":6414,"journal":{"name":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","volume":"2014 1","pages":"297-303"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"244","resultStr":"{\"title\":\"Fault modeling and simulation for crosstalk in system-on-chip interconnects\",\"authors\":\"M. Cuviello, S. Dey, Xiaoliang Bai, Yi Zhao\",\"doi\":\"10.1109/ICCAD.1999.810665\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"System-on-chips (SOCs) using ultra deep sub-micron (DSM) technologies and GHz clock frequencies have been predicted by the 1997 SIA Road Map. Recent studies, as well as experiments reported in this paper, show significant crosstalk effects in long on-chip interconnects of GHz DSM chips. Recognizing the importance of high-speed, reliable interconnects in GHz SOCs, we address in this paper the problem of testing for glitch and delay errors caused by crosstalk in buses and interconnects between components of a SOC. Since it is not possible to explicitly test for all the possible process variations and defects that can lead to crosstalk errors in SOC interconnects, we present an abstract model, Maximum Aggressor (MA) fault model, and its test requirements. The attractiveness of the model is that it can abstract crosstalk defects in interconnects with a linear number of faults, while the corresponding MA tests provide complete coverage for all level defects related to cross-coupling capacitance the interconnects. A SPICE-level fault simulation methodology is presented which allows simulation of a small subset of the potentially exponential number of defects. The simulation methodology also enables validation of the proposed fault model and the resulting test set.\",\"PeriodicalId\":6414,\"journal\":{\"name\":\"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)\",\"volume\":\"2014 1\",\"pages\":\"297-303\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"244\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.1999.810665\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1999.810665","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 244

摘要

采用超深亚微米(DSM)技术和GHz时钟频率的片上系统(soc)已经在1997年SIA路线图中得到了预测。最近的研究和本文报道的实验表明,在GHz DSM芯片的长片上互连中存在显著的串扰效应。认识到在GHz SOC中高速、可靠互连的重要性,我们在本文中解决了由总线串扰和SOC组件之间互连引起的故障和延迟错误的测试问题。由于不可能明确测试所有可能导致SOC互连串扰错误的工艺变化和缺陷,因此我们提出了一个抽象模型,即最大侵略者(MA)故障模型及其测试要求。该模型的吸引人之处在于它可以抽象出具有线性故障数的互连中的串扰缺陷,而相应的MA测试则完全覆盖了与互连交叉耦合电容相关的所有级别缺陷。提出了一种spice级故障模拟方法,该方法可以模拟潜在指数数量缺陷的一小部分。仿真方法还可以验证所提出的故障模型和结果测试集。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fault modeling and simulation for crosstalk in system-on-chip interconnects
System-on-chips (SOCs) using ultra deep sub-micron (DSM) technologies and GHz clock frequencies have been predicted by the 1997 SIA Road Map. Recent studies, as well as experiments reported in this paper, show significant crosstalk effects in long on-chip interconnects of GHz DSM chips. Recognizing the importance of high-speed, reliable interconnects in GHz SOCs, we address in this paper the problem of testing for glitch and delay errors caused by crosstalk in buses and interconnects between components of a SOC. Since it is not possible to explicitly test for all the possible process variations and defects that can lead to crosstalk errors in SOC interconnects, we present an abstract model, Maximum Aggressor (MA) fault model, and its test requirements. The attractiveness of the model is that it can abstract crosstalk defects in interconnects with a linear number of faults, while the corresponding MA tests provide complete coverage for all level defects related to cross-coupling capacitance the interconnects. A SPICE-level fault simulation methodology is presented which allows simulation of a small subset of the potentially exponential number of defects. The simulation methodology also enables validation of the proposed fault model and the resulting test set.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信