高掺杂n型InAlAs给体层InGaAs/InAlAs异质结构场效应晶体管的材料特性

C. Heedt, P. Gottwald, W. Prost, F. Tegude, H. Kunzel, J. Dickmann, H. Dambkes
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引用次数: 1

摘要

讨论了给体层掺杂对与InP衬底匹配的InGaAs/InAlAs hfet晶格的影响。用MBE法生长了几种不同供体浓度的HFET层以及掺杂和未掺杂的表面层。采用光学接触光刻技术,制备了高性能器件(L/sub G/=0.8 μ m, f/sub max/>120 GHz),用于直流、射频、霍尔、TLM、PL和光电容测量。高通道浓度(n/sub - s/>4*10/sup 12/ cm/sup -2/)在给体层(n/sub - D/=1*10/sup 19/ cm/sup -3/)中获得,并且表面掺杂不会改善器件性能,但会增加输出电导并限制可用漏极偏置的范围。射频性能主要受器件栅极长度的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Material characterisation of InGaAs/InAlAs heterostructure field effect transistors with heavily doped n-type InAlAs donor layer
The impact of donor layer doping on InGaAs/InAlAs HFETs lattice matched to InP substrates is discussed. Several HFET layers with different donor concentrations and doped and undoped surface layers were grown by MBE. Using optical contact lithography, high performance devices (L/sub G/=0.8 mu m, f/sub max/>120 GHz) were prepared for characterization using DC, RF, Hall, TLM, PL, and photocapacitance measurements. High channel concentrations (n/sub s/>4*10/sup 12/ cm/sup -2/) were achieved at very high doping levels in the donor layer (N/sub D/=1*10/sup 19/ cm/sup -3/) and that surface doping does not improve device performance, but increases the output conductance and limits the range of usable drain bias. RF performance is mainly affected by the gate length of the device.<>
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