{"title":"氧化铝基板上厚印刷铜膜的性能","authors":"J. Hlina, J. Řeboun, A. Hamácek","doi":"10.1109/ISSE.2019.8810277","DOIUrl":null,"url":null,"abstract":"This paper is focused on the properties of Thick Printed Copper (TPC)films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on the electrical, mechanical and thermal properties of these films. The changes in these properties depending on the thickness of TPC films are described in this paper.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"54 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Properties of Thick Printed Copper Films on Alumina Substrates\",\"authors\":\"J. Hlina, J. Řeboun, A. Hamácek\",\"doi\":\"10.1109/ISSE.2019.8810277\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper is focused on the properties of Thick Printed Copper (TPC)films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on the electrical, mechanical and thermal properties of these films. The changes in these properties depending on the thickness of TPC films are described in this paper.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"54 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810277\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810277","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Properties of Thick Printed Copper Films on Alumina Substrates
This paper is focused on the properties of Thick Printed Copper (TPC)films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on the electrical, mechanical and thermal properties of these films. The changes in these properties depending on the thickness of TPC films are described in this paper.
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