用于电子设备冷却的纳米级工程表面

P. Shandilya, A. Shaji, K. Sankaran
{"title":"用于电子设备冷却的纳米级工程表面","authors":"P. Shandilya, A. Shaji, K. Sankaran","doi":"10.1063/1.5122483","DOIUrl":null,"url":null,"abstract":"Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...","PeriodicalId":7262,"journal":{"name":"ADVANCES IN BASIC SCIENCE (ICABS 2019)","volume":"102 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Nanoscale engineered surfaces for cooling in electronic devices\",\"authors\":\"P. Shandilya, A. Shaji, K. Sankaran\",\"doi\":\"10.1063/1.5122483\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...\",\"PeriodicalId\":7262,\"journal\":{\"name\":\"ADVANCES IN BASIC SCIENCE (ICABS 2019)\",\"volume\":\"102 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ADVANCES IN BASIC SCIENCE (ICABS 2019)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1063/1.5122483\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ADVANCES IN BASIC SCIENCE (ICABS 2019)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/1.5122483","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

纳米级工程表面可以用作集成电路中的冷却结构(散热器)。与标准材料相比,这些先进材料的性能得到了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nanoscale engineered surfaces for cooling in electronic devices
Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...
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