粘接过程中切屑温度对刨花板性能的影响

IF 1.2 4区农林科学 Q3 MATERIALS SCIENCE, PAPER & WOOD

Maderas-ciencia Y Tecnologia Pub Date : 2023-03-01 DOI:10.4067/s0718-221x2023000100417

A. Istek, Özgür Yiğittap, İsmail Özlüsoylu

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引用次数: 1

摘要

在刨花板的生产中，从干燥箱出来的碎片通常没有充分冷却就进入粘合过程。此外，随着粘接过程中摩擦的影响，芯片温度的升高会增加树脂/粘合剂的消耗，影响板的性能。研究了粘接过程中切屑温度对刨花板性能的影响。为此，在芯片粘合过程中测量了六种不同温度(25°C, 30°C, 35°C, 40°C, 50°C, 55°C)，以确定其效果。结果表明，在键合过程中测量的芯片温度为30°C - 40°C时，可以获得最佳的电路板性能。此外，确定在粘合过程中超过40°C的芯片温度会显著降低机械性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effect of chip temperature during bonding on particleboard properties

In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and affects the properties of the board. This study investigated the effect of chip temperature during the bonding process on the properties of particleboard. With this aim, the effects were determined for six different temperatures (25 °C, 30 °C, 35 °C, 40 °C, 50 °C, 55 °C) measured during the bonding of the chips. According to the results, optimum board properties were obtained from the groups in which the chip temperature measured during the bonding process was 30 °C - 40 °C. Furthermore, it was determined that chip temperatures of above 40 °C during the bonding process significantly reduced the mechanical properties .

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来源期刊

Maderas-ciencia Y Tecnologia 工程技术-材料科学：纸与木材

CiteScore

2.60

自引率

13.30%

发文量

审稿时长

>12 weeks

期刊介绍： Maderas-Cienc Tecnol publishes inedits and original research articles in Spanish and English. The contributions for their publication should be unpublished and the journal is reserved all the rights of reproduction of the content of the same ones. All the articles are subjected to evaluation to the Publishing Committee or external consultants. At least two reviewers under double blind system. Previous acceptance of the Publishing Committee, summaries of thesis of Magíster and Doctorate are also published, technical opinions, revision of books and reports of congresses, related with the Science and the Technology of the Wood. The journal have not articles processing and submission charges.