用于扩展后硅调试的应用级硬件跟踪

D. Pal, Abhishek Sharma, S. Ray, F. M. D. Paula, Shobha Vasudevan
{"title":"用于扩展后硅调试的应用级硬件跟踪","authors":"D. Pal, Abhishek Sharma, S. Ray, F. M. D. Paula, Shobha Vasudevan","doi":"10.1145/3195970.3195992","DOIUrl":null,"url":null,"abstract":"We present a method for selecting trace messages for post-silicon validation of Systems-on-a-Chips (SoCs) with diverse usage scenarios. We model specifications of interacting flows in typical applications. Our method optimizes trace buffer utilization and flow specification coverage. We present debugging and root cause analysis of subtle bugs in the industry scale OpenSPARC T2 processor. We demonstrate that this scale is beyond the capacity of current tracing approaches. We achieve trace buffer utilization of 98.96% with a flow specification coverage of 94.3% (average). We localize bugs to 21.11% (average) of the potential root causes in our large-scale debugging effort.","PeriodicalId":6491,"journal":{"name":"2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)","volume":"68 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Application Level Hardware Tracing for Scaling Post-Silicon Debug\",\"authors\":\"D. Pal, Abhishek Sharma, S. Ray, F. M. D. Paula, Shobha Vasudevan\",\"doi\":\"10.1145/3195970.3195992\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a method for selecting trace messages for post-silicon validation of Systems-on-a-Chips (SoCs) with diverse usage scenarios. We model specifications of interacting flows in typical applications. Our method optimizes trace buffer utilization and flow specification coverage. We present debugging and root cause analysis of subtle bugs in the industry scale OpenSPARC T2 processor. We demonstrate that this scale is beyond the capacity of current tracing approaches. We achieve trace buffer utilization of 98.96% with a flow specification coverage of 94.3% (average). We localize bugs to 21.11% (average) of the potential root causes in our large-scale debugging effort.\",\"PeriodicalId\":6491,\"journal\":{\"name\":\"2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)\",\"volume\":\"68 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3195970.3195992\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3195970.3195992","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

我们提出了一种选择跟踪消息的方法,用于具有不同使用场景的片上系统(soc)的硅后验证。我们对典型应用程序中交互流的规范进行建模。我们的方法优化了跟踪缓冲区利用率和流规范覆盖率。本文介绍了工业规模OpenSPARC T2处理器中细微错误的调试和根本原因分析。我们证明了这种规模超出了当前跟踪方法的能力。我们实现了98.96%的跟踪缓冲区利用率,流规范覆盖率为94.3%(平均)。在大规模调试工作中,我们将bug定位为21.11%(平均)的潜在根本原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Application Level Hardware Tracing for Scaling Post-Silicon Debug
We present a method for selecting trace messages for post-silicon validation of Systems-on-a-Chips (SoCs) with diverse usage scenarios. We model specifications of interacting flows in typical applications. Our method optimizes trace buffer utilization and flow specification coverage. We present debugging and root cause analysis of subtle bugs in the industry scale OpenSPARC T2 processor. We demonstrate that this scale is beyond the capacity of current tracing approaches. We achieve trace buffer utilization of 98.96% with a flow specification coverage of 94.3% (average). We localize bugs to 21.11% (average) of the potential root causes in our large-scale debugging effort.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信