芯片上集成氧化碲窃窃廊谐振器的硅波导(会议报告)

H. Frankis, Dawson B. Bonneville, Daniel Su, J. Bradley
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摘要

碲酸盐玻璃在线性和非线性集成光学器件中具有广阔的应用前景。碲酸盐玻璃具有较高的稀土溶解度,可用于稀土掺杂激光器,并具有较高的非线性折射率、拉曼增益系数和声光特性。然而,在硅光子学中很难利用碲酸盐玻璃的特性,因为用于硅光子器件的波导材料通常限于硅、二氧化硅、氮化硅和锗。本文报道了一种集成在硅光子芯片上并与硅波导耦合的氧化碲窃窃廊谐振器。硅波导采用标准铸造工艺制造,并将包层氧化物蚀刻成环形,在0.2至1.0 μm的间隙与母线波导精确对齐,形成腔体。后处理沉积的氧化碲薄膜覆盖在蚀刻的氧化腔的底部,形成氧化碲波导层,光可以从硅波导耦合到其中。测量了半径为40 μm、氧化碲涂层厚度为1.1 μm的谐振腔,其内部q因子大于1E5。这些结果说明了将碲酸盐玻璃器件集成到硅光子微系统中的潜力。本文将讨论这种腔体结构在光学传感中的应用、设计考虑和提高性能的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon waveguide integrated with a tellurium oxide whispering gallery resonator on chip (Conference Presentation)
Tellurite glasses have promising material properties in applications for linear and nonlinear integrated optical devices. Tellurite glasses have high rare earth solubilities for applications in rare earth doped lasers as well as high nonlinear refractive indices, Raman gain coefficients and acousto-optic figures of merit. However, it is difficult to take advantage of tellurite glass properties in silicon photonics, as the waveguiding materials available for use in silicon photonic devices are typically limited to silicon, silicon dioxide, silicon nitride, and germanium. Here, we report on a tellurium oxide whispering gallery resonator, integrated onto a silicon photonic chip and coupled to a silicon waveguide. The silicon waveguides are fabricated using a standard foundry process and the cladding oxide is etched in a ring shape with precise alignment to the bus waveguides at gaps from 0.2 to 1.0 μm to form the cavity. Post processing deposition of a tellurium oxide film coats the bottom of the etched oxide cavity, forming a tellurium oxide waveguiding layer, into which light can be coupled from the silicon waveguide. A resonator with a radius of 40 μm and a 1.1-μm-thick tellurium oxide coating is measured to have an internal Q-factor of greater than 1E5. These results illustrate the potential for integration of tellurite glass devices into silicon photonic microsystems. Applications of this cavity structure in optical sensing, design considerations and methods to improve performance will be discussed.
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