基于不同晶胞拓扑结构的相变材料注入胞胞材料的瞬态热性能

IF 2.8 4区 工程技术 Q2 ENGINEERING, MECHANICAL
Karthik Nithyanandam, Prashant Singh
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引用次数: 0

摘要

相变材料(PCM)由于其固有的低导热性,在热管理和储能应用中的应用受到限制。当注入具有高孔隙率和高固相导热系数的多孔介质中时,PCMs的热性能得到显著增强。早期的研究通常采用通过传统制造工艺获得的高孔隙率泡沫铝,通常称为发泡。通过发泡法制备的金属泡沫的典型代表单元胞可以是四面体形状。传统的高孔隙率金属泡沫的制造工艺在单胞形状、孔隙率和孔隙密度方面具有有限的灵活性。金属增材制造的进步有可能解决这种制造限制,并在上述设计领域提供自由。为此,我们探索了四种不同的单元胞拓扑结构,即八面体,四面十面体,面对角线立方体和立方体,以了解它们在注入pcm时增强瞬态热性能的作用。采用焓-孔隙度法对相变过程进行了模拟。研究发现,固体介质的存在显著提高了PCM的热性能,八元体单元电池的性能优于本研究中探索的其他单元电池拓扑结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Transient Thermal Performance Of Phase-Change Material Infused In Cellular Materials Based On Different Unit Cell Topologies
Phase change material (PCM) employment in thermal management and energy storage applications is limited due to their inherently low thermal conductivity. Significant enhancement in the thermal performance of PCMs can be obtained when infused in porous media with high porosity and high solid-phase thermal conductivity. Earlier studies typically employ high porosity Aluminum foams obtained via a conventional manufacturing process, commonly known as foaming. A typical representative unit cell of metal foams obtained via foaming process can be of tetrakaidecahedron shape. The conventional manufacturing process of high porosity metal foams offers limited flexibility over unit cell shape, porosity, and pore density. Metal additive manufacturing advancements have the potential to address this manufacturing limitation and provides freedom in the above design domain. To this end, we have explored four different unit cell topologies, viz. Octet, Tetrakaidecahedron, Face-diagonal Cube, and Cube, for their role in enhancing the transient thermal performance when infused with PCMs. An enthalpy-porosity method has been employed to model the phase-change process for wide range of variables. It has been found that the presence of solid media results in significant enhancement in PCM's thermal performance and the Octet-shaped unit cell outperformed the other unit cell topologies explored in this study.
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来源期刊
自引率
0.00%
发文量
182
审稿时长
4.7 months
期刊介绍: Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.
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