采用扇出和系统级封装技术集成的射频器件

C. Kung, Hung-Yi Lin, Chin-Cheng Kuo, Cheng-Syuan Wu, Yu-Ting Chen, Meng-Wei Hsieh, Yu-Chang Hsieh, Pao-Nan Lee
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引用次数: 0

摘要

近年来,更高的性能和更小的外形一直是移动设备的关键主题。为了满足这一需求,系统级封装(SiP)已成为创新的必经之路,也是十年来不可阻挡的趋势。在本研究中,已经说明了将具有有机衬底的SiP演进为具有更高性能和更小外形的新一代移动射频模块的扇出SiP (FOSiP)的好处。设计和制造的FOSiP模块包含6个射频器件,集成了几个核心功能和构建模块,包括芯片级RDL制造,载波系统,晶圆级组装和屏蔽溅射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
RF Devices Integrated by Fan-Out and System-In-Package Technology
Higher performance and smaller form factor are always the critical subjects for mobile device in recent years. To meet this demand, System-In-Package (SiP) has become a certain path for innovation and an unstoppable trend for decade. In this study, the benefits of evolving SiP with organic substrate to Fan-Out SiP (FOSiP) for new generation mobile RF module with higher performance and smaller form factor has been illustrated. A designed and manufactured FOSiP module with 6 RF devices integrated by several core features and building blocks would be demonstrated, including chip-last RDL manufacturing, carrier system, wafer level assembly and shielding sputtering.
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