预氧化对铝硅涂层耐热腐蚀性能的影响

IF 0.6 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
R. Palanivel, Soundararaja Perumal Vigneshwaran, Y. Alqurashi, M. A. Rasheed
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引用次数: 0

摘要

铝(Al)和铜(Cu)的连接是可再生能源应用中必不可少的点焊,因为它具有优异的导热性和导电性。使用传统技术生产高质量的铝铜点焊具有挑战性,焊件的耐久性也不确定。摩擦熔接(FMB)点焊是一种有效且适用于铜铝点焊的新型焊接技术。焊接过程中采用的工艺参数对焊缝质量有很大的影响。将FMB工艺特征(如刀具转速和停留时间)集成到一个数学模型中,该模型可用于预测不同点状接头的工艺参数,这是本研究的重点。结果表明,刀具转速和停留时间对拉伸剪切断裂载荷(TSFL)有显著影响。采用响应面法(RSM)对AA 6061-Cu异种点焊FMB工艺参数进行了优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
EFFECTS OF PRE-OXIDATION ON HOT CORROSION RESISTANCE OF Al–Si COATINGS
The joining of aluminium (Al) and copper (Cu) is an essential spot weld for renewable energy applications due to its excellent thermal and electrical conductivity. It is challenging to produce a high-quality Al-Cu spot weld using traditional techniques and the durability of a weldment is also uncertain. A new welding technique that is effective and suitable for spot welding Cu and Al is friction-melt-bonding (FMB) spot welding. The process parameters employed during welding have a strong impact on the quality of a weld. The strategy for integrating the FMB process characteristics, such as tool rotational speed and dwell time, into a mathematical model that may be used for predicting the process parameters of dissimilar spot joints, was the focus of this study. The findings showed that the tensile shear fracture load (TSFL) was significantly influenced by the tool's rotational speed and dwell time. Optimization was carried out using the response surface methodology (RSM) to find the best FMB process parameters for making a dissimilar spot weld of AA 6061-Cu.
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来源期刊
Materiali in tehnologije
Materiali in tehnologije 工程技术-材料科学:综合
CiteScore
1.30
自引率
0.00%
发文量
73
审稿时长
4-8 weeks
期刊介绍: The journal MATERIALI IN TEHNOLOGIJE/MATERIALS AND TECHNOLOGY is a scientific journal, devoted to original papers and review scientific papers concerned with the areas of fundamental and applied science and technology. Topics of particular interest include metallic materials, inorganic materials, polymers, vacuum technique and lately nanomaterials.
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