具有可编程回转速率和死区时间的压电微泵驱动模块

IF 0.6 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
M. Mozek, B. Pecar
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引用次数: 1

摘要

设计、实现并表征了用于驱动定制型压电微泵的具有可编程回转速率和死区时间的高效压电微泵驱动模块。开发的驱动器可以独立设置几个矩形输出信号参数,如频率,正负幅值,回转速率,死区时间和操作模式(泵/阀)。实现的驱动器可以在从DC到1 kHz的频率范围内实现高达250 VPP的幅值,在最大功耗1.6 W (180 mA @ 9 V)下,回转速率高达18 V/µs。与我们之前的RC充放电信号形状驱动器相比,本版本将微泵的空气流动能力从1.6 sccm增加到4.2 sccm。它可以驱动200 μ m厚的PZT致动器,电容为12 nF。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Piezoelectric Micropump Driving Module with Programmable Slew-Rate and Dead-Time
: High efficiency piezoelectric micropump driving module with programmable slew-rate and dead-time has been designed, implemented and characterized for driving custom made piezoelectric micropumps. Developed driver enables independent setting of several rectangular output signal parameters, such as frequency, positive and negative amplitudes, slew-rates, dead time, and modes of operation (pump/valve). Implemented driver can achieve amplitudes up to 250 VPP on a frequency range from DC to 1 kHz, slew-rate up to 18 V/µs at maximum power consumption 1.6 W (180 mA @ 9 V). In comparison with our previous driver with RC charge/discharge signal shape, presented version increases air flow capability of micropumps from 1.6 sccm to 4.2 sccm. It enables driving of 200 µm thick PZT actuators with 12 nF capacitance.
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来源期刊
CiteScore
1.80
自引率
0.00%
发文量
10
审稿时长
>12 weeks
期刊介绍: Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material. Topics of interest include: Microelectronics, Semiconductor devices, Nanotechnology, Electronic circuits and devices, Electronic sensors and actuators, Microelectromechanical systems (MEMS), Medical electronics, Bioelectronics, Power electronics, Embedded system electronics, System control electronics, Signal processing, Microwave and millimetre-wave techniques, Wireless and optical communications, Antenna technology, Optoelectronics, Photovoltaics, Ceramic materials for electronic devices, Thick and thin film materials for electronic devices.
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