焊料表面张力值的测量

J. Urbánek, K. Dušek
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引用次数: 9

摘要

了解表面张力的实际值对于理解焊接的几个方面很重要,例如润湿,接头形状,助焊剂作用,特别是可焊性测试的量化。波峰焊需要高表面张力。表面张力值主要由测量条件(温度、环境空气、不同成分的惰性气氛等)引起。在我们的测量中,我们使用了一种可焊性评估方法,即润湿平衡法,它用于测量润湿力。将润湿性测试仪(有时称为半月板仪)放置在可能降低氧浓度的盒子中。在两种不同类型的焊料(含铅和无铅)和非润湿测量试样(聚四氟乙烯,不粘圆柱体)上进行了测量。我们测量了温度和氧还原浓度对润湿力的影响。润湿力的变化与表面张力的变化有关
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Measurements of the solders surface tension values
The knowledge of actual value of surface tension is important for the understanding to several soldering aspects, such as wetting, joint shape, fluxing action and particularly, for the quantification of solderability testing. High surface tension is required for wave soldering. Values of surface tension are mainly caused by measurement conditions (temperature, ambient-air, inert atmosphere of the different composition etc.). For our measurement we used one of the solderability evaluation methods known as the wetting balance method, which is used to measure wetting force. Wettability tester (sometimes called a meniscograph) was placed in the box with the possibility to reduce oxygen concentration. The measurement was carried out on two different types of solders (lead and lead free) and on non-wetting measurement specimen (teflon, nonstick cylinder). We have measured influence of the temperature and reduced oxygen concentration on the wetting force. The change of the wetting force is related to the change of the surface tension
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