F4:高速图像传感器技术

Johannes Solhusvik, J. Ahn, J. Bosiers, B. Fowler, M. Ikeda, S. Kawahito, Jerry Lin, Dan McGrath, Katsu Nakamura, J. Ohta, Ramchan Woo
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引用次数: 1

摘要

高速成像是增长最快的半导体市场之一。目前的增长是由消费者和工业应用驱动的,如高清视频、慢动作回放、机器视觉、3D范围捕捉和机器人技术。本次论坛将介绍用于高速相机的CCD和CMOS图像传感器的芯片架构、电路和系统级解决方案。技术主题包括光子探测器件、像素电路和阵列读出电路、A/D转换器、图像处理和接口电路,由工业界和学术界的世界领先专家介绍。这项技术的潜在应用将通过3D距离成像和机器人的超高速捕获解决方案来展示。对于高级应用,描述了使用模拟或数字接口输出高吞吐量像素数据的技术。论坛将以小组讨论结束,与会者有机会提问和分享他们的观点,这个全天的论坛鼓励公开的信息交流。目标参与者是从事图像传感器和相机系统设计的电路设计师和概念工程师。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
F4: High-speed image sensor technologies
High speed imaging is one of the fastest growing semiconductor markets. Growth is currently driven by consumer and industrial applications such as HD video, slow motion play-back, machine vision, 3D range capture, and robotics. This forum will present chip architectures, circuits, and system-level solutions used in CCD and CMOS image sensors for high speed cameras. Technology topics include photon detection devices, pixel circuits and array readout circuits, A/D converters, image processing and interface circuits presented by world leading experts from industry and academia. The potential applications of this technology will be demonstrated by ultra high speed capture solutions for 3D range imaging and robotics. For advanced applications, techniques for outputing high-throughput pixel data using analog or digital interfaces are described. The forum will conclude with a panel discussion where the attendees have the opportunity to ask questions and to share their views, and this all-day forum encourages open information exchange. The targeted participants are circuit designers and concept engineers working on image sensor and camera system design.
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