继续缩小:新一代光刻技术-进展与前景

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers Pub Date : 2013-03-28 DOI:10.1109/ISSCC.2013.6487620

M. V. D. Brink

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引用次数: 7

摘要

芯片制造商越来越担心芯片的缩水和成本。这种担忧促使不同产品采用不同的光刻解决方案。可以观察到两个主要趋势:积极采用EUV，或积极扩展沉浸感。进一步降低成本可以通过引入450mm晶圆实现。

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Continuing to shrink: Next-generation lithography - Progress and prospects

Chip makers are increasingly concerned about the shrink and cost. This concern drives different lithography solutions for different products. Two major trends can be observed: aggressive adoption of EUV, or aggressive extension of immersion. Further cost reduction could be achieved by introducing 450mm wafers.

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2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers

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