孔隙率对反应烧结氮化硅热冲击性能的影响

G. Ziegler, J. Heinrich
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引用次数: 17

摘要

研究了反应烧结氮化硅的孔隙大小对其抗热应力破裂能力的影响。采用有机组分在绿色硅致密体中掺入孔隙,并采用不同粒径的硅起始粉制备可控孔隙结构样品。讨论了水淬火后的临界温差ΔTc与影响热冲击的最重要变量的变化的关系,如断裂强度、杨氏弹性模量和导热系数。结果表明:在总孔隙度及其他微观结构参数一定的情况下,孔隙尺寸的增大导致ΔTc减小;此外,研究结果表明,热导率在解释反应烧结Si3N4的热冲击行为中起着重要作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of porosity on the thermal shock behaviour of reaction-sintered silicon nitride

Reaction-sintered silicon nitride was investigated to determine the effect of its pore size on thermal stress resistance to fracture initiation. Samples of controlled pore structure were prepared by using an organic component to incorporate pores in the green silicon compact as well as by using silicon starting powders with different particle size. Critical temperature differences ΔTc after water quenching is discussed in relation to changes in most important variables affecting thermal shock, such as fracture strength, Young's modulus of elasticity and thermal conductivity. The results show that when total porosity as well as other microstructural parameters are held constant, an increase in pore size leads to a decrease in ΔTc. Moreover, the results indicate that thermal conductivity plays a significant role in the interpretation of the thermal shock behaviour of reaction-sintered Si3N4.

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