{"title":"下一代无线应用的微波器件和电路挑战","authors":"L. Larson","doi":"10.1109/WCT.2003.1321436","DOIUrl":null,"url":null,"abstract":"The rapid deployment of next generation communications systems - both wired and wireless on a world-wide basis creates a unique opportunity for the semiconductor industry. High-speed networks require massive computing power and analog and radiofrequency devices with wide dynamic range and bandwidth. The semiconductor technologies required to implement these systems are highlighted, with particular emphasis on the technologies required to meet the demands of mobile computing applications.","PeriodicalId":6305,"journal":{"name":"2003 IEEE Topical Conference on Wireless Communication Technology","volume":"150 1","pages":"74-77"},"PeriodicalIF":0.0000,"publicationDate":"2003-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Microwave device and circuit challenges for next generation wireless applications\",\"authors\":\"L. Larson\",\"doi\":\"10.1109/WCT.2003.1321436\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The rapid deployment of next generation communications systems - both wired and wireless on a world-wide basis creates a unique opportunity for the semiconductor industry. High-speed networks require massive computing power and analog and radiofrequency devices with wide dynamic range and bandwidth. The semiconductor technologies required to implement these systems are highlighted, with particular emphasis on the technologies required to meet the demands of mobile computing applications.\",\"PeriodicalId\":6305,\"journal\":{\"name\":\"2003 IEEE Topical Conference on Wireless Communication Technology\",\"volume\":\"150 1\",\"pages\":\"74-77\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-10-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2003 IEEE Topical Conference on Wireless Communication Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WCT.2003.1321436\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 IEEE Topical Conference on Wireless Communication Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WCT.2003.1321436","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Microwave device and circuit challenges for next generation wireless applications
The rapid deployment of next generation communications systems - both wired and wireless on a world-wide basis creates a unique opportunity for the semiconductor industry. High-speed networks require massive computing power and analog and radiofrequency devices with wide dynamic range and bandwidth. The semiconductor technologies required to implement these systems are highlighted, with particular emphasis on the technologies required to meet the demands of mobile computing applications.
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