八角形集成电感多层热传导热模型

{"title":"八角形集成电感多层热传导热模型","authors":"Y. Benhadda, M. Derkaoui, F. Z. Medjaoui, Azzedine Hamid","doi":"10.1109/SSD54932.2022.9955661","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":6799,"journal":{"name":"2021 18th International Multi-Conference on Systems, Signals & Devices (SSD)","volume":"128 1","pages":"1323-1328"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Model for Heat Conduction in Octagonal Integrated Inductor Multilayer\",\"authors\":\"Y. Benhadda, M. Derkaoui, F. Z. Medjaoui, Azzedine Hamid\",\"doi\":\"10.1109/SSD54932.2022.9955661\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":6799,\"journal\":{\"name\":\"2021 18th International Multi-Conference on Systems, Signals & Devices (SSD)\",\"volume\":\"128 1\",\"pages\":\"1323-1328\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 18th International Multi-Conference on Systems, Signals & Devices (SSD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SSD54932.2022.9955661\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 18th International Multi-Conference on Systems, Signals & Devices (SSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSD54932.2022.9955661","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}