退火低电流密度镍镀层脆化原因分析

D.M. Braddick , S.J. Harris
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引用次数: 1

摘要

本文对低电流密度(21.5 A/m2)瓦镍镀层退火过程中晶界气泡的性质和产生原因进行了研究。化学分析表明,低电积镍比高电积镍含有更多的氧和氢,而且碳在所有的电积镍中都存在。在低cd下测得的Tafel斜率的变化可能表明阴极氧还原反应,这可以解释分析结果。质谱实验表明,在600°C以上的温度下,从21.5 A/m2的镍中产生一氧化碳气体。这表明低cd材料中较高的碳和氧浓度有利于形成高密度的充气孔隙,从而产生所观察到的脆性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Identification of the cause of embrittlement in annealed low current density nickel electrodeposits

An attempt has been made to identify the nature and cause of grain boundary gas bubbles which are formed during the annealing of low current density (21.5 A/m2) Watts nickel electrodeposits. Chemical analysis has shown that low c.d. nickel contains greater quantities of oxygen and hydrogen than do higher c.d. deposits, and that carbon is present in all deposits. Changes in the slopes of Tafel slopes measured at low c.d. possibly indicate a cathodic oxygen reduction reaction which may explain the analysis result. Mass spectrometry experiments indicate that carbon monoxide gas is evolved at temperatures above 600°C from 21.5 A/m2 nickel. It is suggested that the higher concentrations of carbon and oxygen in low c.d. material favour the formation of high densities of gas filled pores and thus produce the observed embrittlement.

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