高性能3D集成电路之路:单片3D集成电路的性能优化方法

Kyungwook Chang, S. Pentapati, D. Shim, S. Lim
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引用次数: 5

摘要

随着我们接近2D器件扩展的极限,单片3D IC (M3D)已经成为提供性能和功耗优势的潜在解决方案。尽管已经进行了各种各样的研究来提高M3D设计的功耗节约,但很少有人努力提高其性能。在本文中,我们首次对影响M3D性能的因素进行了深入的分析,并提出了提高性能的方法。我们的方法优于最先进的M3D设计流程,比2D设计提供15.6%的性能改进和16.2%的能量延迟产品(EDP)优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Road to High-Performance 3D ICs: Performance Optimization Methodologies for Monolithic 3D ICs
As we approach the limits of 2D device scaling, monolithic 3D IC (M3D) has emerged as a potential solution offering performance and power benefits. Although various studies have been done to increase power savings of M3D designs, efforts to improve their performance are rarely made. In this paper, we, for the first time, perform in-depth analysis of the factors that affect the performance of M3D, and present methodologies to improve the performance. Our methodologies outperform the state-of-the-art M3D design flow by offering 15.6% performance improvement and 16.2% energy-delay product (EDP) benefit over 2D designs.
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