具有高重复性的122 ghz芯片-天线线键互连

2012 IEEE/MTT-S International Microwave Symposium Digest Pub Date : 2012-06-17 DOI:10.1109/MWSYM.2012.6258339

S. Beer, H. Gulan, M. Pauli, C. Rusch, G. Kunkel, T. Zwick

{"title":"具有高重复性的122 ghz芯片-天线线键互连","authors":"S. Beer, H. Gulan, M. Pauli, C. Rusch, G. Kunkel, T. Zwick","doi":"10.1109/MWSYM.2012.6258339","DOIUrl":null,"url":null,"abstract":"This paper presents a 122-GHz chip-to-antenna wire bond interconnect for low-cost, fully integrated transceivers. It is based on the standard ball-stitch bond technology and uses planar transmission lines for matching. A study on the effects of process tolerances is given. Finally, an antenna which is integrated into a QFN plastic package is characterized together with the chip-to-antenna interconnect.","PeriodicalId":6385,"journal":{"name":"2012 IEEE/MTT-S International Microwave Symposium Digest","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":"{\"title\":\"122-GHz chip-to-antenna wire bond interconnect with high repeatability\",\"authors\":\"S. Beer, H. Gulan, M. Pauli, C. Rusch, G. Kunkel, T. Zwick\",\"doi\":\"10.1109/MWSYM.2012.6258339\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a 122-GHz chip-to-antenna wire bond interconnect for low-cost, fully integrated transceivers. It is based on the standard ball-stitch bond technology and uses planar transmission lines for matching. A study on the effects of process tolerances is given. Finally, an antenna which is integrated into a QFN plastic package is characterized together with the chip-to-antenna interconnect.\",\"PeriodicalId\":6385,\"journal\":{\"name\":\"2012 IEEE/MTT-S International Microwave Symposium Digest\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"19\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE/MTT-S International Microwave Symposium Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2012.6258339\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE/MTT-S International Microwave Symposium Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2012.6258339","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 19

摘要

本文提出了一种用于低成本、全集成收发器的122 ghz芯片-天线线键互连。它以标准的球缝粘合技术为基础，采用平面传输线进行匹配。对工艺公差的影响进行了研究。最后，对集成在QFN塑料封装中的天线以及芯片-天线互连进行了表征。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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122-GHz chip-to-antenna wire bond interconnect with high repeatability

This paper presents a 122-GHz chip-to-antenna wire bond interconnect for low-cost, fully integrated transceivers. It is based on the standard ball-stitch bond technology and uses planar transmission lines for matching. A study on the effects of process tolerances is given. Finally, an antenna which is integrated into a QFN plastic package is characterized together with the chip-to-antenna interconnect.

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2012 IEEE/MTT-S International Microwave Symposium Digest

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