迈向更智能的诊断

Qicheng Huang, Chenlei Fang, Soumya Mittal, R. D. Blanton
{"title":"迈向更智能的诊断","authors":"Qicheng Huang, Chenlei Fang, Soumya Mittal, R. D. Blanton","doi":"10.1145/3398267","DOIUrl":null,"url":null,"abstract":"Given the inherent perturbations during the fabrication process of integrated circuits that lead to yield loss, diagnosis of failing chips is a mitigating method employed during both yield ramping and high-volume manufacturing for yield learning. However, various uncertainties in the fabrication process bring a number of challenges, resulting in diagnosis with undesirable outcomes or low efficiency, including, for example, diagnosis failure, bad resolution, and extremely long runtime. It would therefore be very beneficial to have a comprehensive preview of diagnostic outcomes beforehand, which allows fail logs to be prioritized in a more reasonable way for smarter allocation of diagnosis resources. In this work, we propose a learning-based previewer, which is able to predict five aspects of diagnostic outcomes for a failing IC, including diagnosis success, defect count, failure type, resolution, and runtime magnitude. The previewer consists of three classification models and one regression model, where Random Forest classification and regression are used. Experiments on a 28 nm test chip and a high-volume 90 nm part demonstrate that the predictors can provide accurate prediction results, and in a virtual application scenario the overall previewer can bring up to 9× speed-up for the test chip and 6× for the high-volume part.","PeriodicalId":6933,"journal":{"name":"ACM Transactions on Design Automation of Electronic Systems (TODAES)","volume":"92 1","pages":"1 - 20"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Towards Smarter Diagnosis\",\"authors\":\"Qicheng Huang, Chenlei Fang, Soumya Mittal, R. D. Blanton\",\"doi\":\"10.1145/3398267\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Given the inherent perturbations during the fabrication process of integrated circuits that lead to yield loss, diagnosis of failing chips is a mitigating method employed during both yield ramping and high-volume manufacturing for yield learning. However, various uncertainties in the fabrication process bring a number of challenges, resulting in diagnosis with undesirable outcomes or low efficiency, including, for example, diagnosis failure, bad resolution, and extremely long runtime. It would therefore be very beneficial to have a comprehensive preview of diagnostic outcomes beforehand, which allows fail logs to be prioritized in a more reasonable way for smarter allocation of diagnosis resources. In this work, we propose a learning-based previewer, which is able to predict five aspects of diagnostic outcomes for a failing IC, including diagnosis success, defect count, failure type, resolution, and runtime magnitude. The previewer consists of three classification models and one regression model, where Random Forest classification and regression are used. Experiments on a 28 nm test chip and a high-volume 90 nm part demonstrate that the predictors can provide accurate prediction results, and in a virtual application scenario the overall previewer can bring up to 9× speed-up for the test chip and 6× for the high-volume part.\",\"PeriodicalId\":6933,\"journal\":{\"name\":\"ACM Transactions on Design Automation of Electronic Systems (TODAES)\",\"volume\":\"92 1\",\"pages\":\"1 - 20\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACM Transactions on Design Automation of Electronic Systems (TODAES)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3398267\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM Transactions on Design Automation of Electronic Systems (TODAES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3398267","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

考虑到集成电路制造过程中固有的扰动会导致良率损失,故障芯片的诊断是良率学习在良率提升和大批量生产中使用的一种缓解方法。然而,制造过程中的各种不确定性带来了许多挑战,导致诊断结果不理想或效率低,包括诊断失败、分辨率差和运行时间过长。因此,事先对诊断结果进行全面预览是非常有益的,这允许以更合理的方式对故障日志进行优先级排序,从而更智能地分配诊断资源。在这项工作中,我们提出了一个基于学习的预览器,它能够预测失败IC的诊断结果的五个方面,包括诊断成功、缺陷计数、故障类型、解决和运行时大小。预览器由三个分类模型和一个回归模型组成,其中使用随机森林分类和回归。在28nm测试芯片和90nm大批量部件上的实验表明,该预测器可以提供准确的预测结果,在虚拟应用场景中,整体预览器可以为测试芯片带来9倍的加速,为大批量部件带来6倍的加速。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Towards Smarter Diagnosis
Given the inherent perturbations during the fabrication process of integrated circuits that lead to yield loss, diagnosis of failing chips is a mitigating method employed during both yield ramping and high-volume manufacturing for yield learning. However, various uncertainties in the fabrication process bring a number of challenges, resulting in diagnosis with undesirable outcomes or low efficiency, including, for example, diagnosis failure, bad resolution, and extremely long runtime. It would therefore be very beneficial to have a comprehensive preview of diagnostic outcomes beforehand, which allows fail logs to be prioritized in a more reasonable way for smarter allocation of diagnosis resources. In this work, we propose a learning-based previewer, which is able to predict five aspects of diagnostic outcomes for a failing IC, including diagnosis success, defect count, failure type, resolution, and runtime magnitude. The previewer consists of three classification models and one regression model, where Random Forest classification and regression are used. Experiments on a 28 nm test chip and a high-volume 90 nm part demonstrate that the predictors can provide accurate prediction results, and in a virtual application scenario the overall previewer can bring up to 9× speed-up for the test chip and 6× for the high-volume part.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信