{"title":"基于QFN的毫米波收发器封装概念","authors":"T. Zwick, S. Beer","doi":"10.1109/IWAT.2012.6178680","DOIUrl":null,"url":null,"abstract":"This paper introduces the idea of a low-cost surface-mountable millimeter-wave radar sensor. Different packaging topologies are compared with the potential of integrating the whole radar frontend together with the antennas into a single QFN package. The pros and cons of the different packaging concepts are discussed and finally, a 120 GHz off-chip antenna design for integration into a QFN package and its measurements are presented.","PeriodicalId":6341,"journal":{"name":"2012 IEEE International Workshop on Antenna Technology (iWAT)","volume":"205 1","pages":"335-338"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"QFN based packaging concepts for millimeter-wave transceivers\",\"authors\":\"T. Zwick, S. Beer\",\"doi\":\"10.1109/IWAT.2012.6178680\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces the idea of a low-cost surface-mountable millimeter-wave radar sensor. Different packaging topologies are compared with the potential of integrating the whole radar frontend together with the antennas into a single QFN package. The pros and cons of the different packaging concepts are discussed and finally, a 120 GHz off-chip antenna design for integration into a QFN package and its measurements are presented.\",\"PeriodicalId\":6341,\"journal\":{\"name\":\"2012 IEEE International Workshop on Antenna Technology (iWAT)\",\"volume\":\"205 1\",\"pages\":\"335-338\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-03-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Workshop on Antenna Technology (iWAT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWAT.2012.6178680\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Workshop on Antenna Technology (iWAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWAT.2012.6178680","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
QFN based packaging concepts for millimeter-wave transceivers
This paper introduces the idea of a low-cost surface-mountable millimeter-wave radar sensor. Different packaging topologies are compared with the potential of integrating the whole radar frontend together with the antennas into a single QFN package. The pros and cons of the different packaging concepts are discussed and finally, a 120 GHz off-chip antenna design for integration into a QFN package and its measurements are presented.