电子封装用环保Sn-58Bi共晶焊料带的制备、微观结构与性能

Lan‐Lan Zhu, Shengfa Liu, W. Xiong, J. Xiong, Zhebing Hu, Chen Chen
{"title":"电子封装用环保Sn-58Bi共晶焊料带的制备、微观结构与性能","authors":"Lan‐Lan Zhu, Shengfa Liu, W. Xiong, J. Xiong, Zhebing Hu, Chen Chen","doi":"10.12783/ISSN.1544-8053/14/1/32","DOIUrl":null,"url":null,"abstract":"Sn-58Bi eutectic solder ribbon was successfully prepared using an improved single-roller rapid solidification device with the optimum process parameters. The microstructure, melting behavior and wettability of Sn-58Bi eutectic solder ribbon prepared by rapid solidification technology (RST) and conventional casting-rolling process (CRP) respectively were investigated by optical microscopy (OM), differential scanning calorimetry (DSC) and wettability tests. The results show that the forming effect of solder ribbons can be obviously improved by mainly optimizing roller line speed, nozzle-to-roller spacing and heating temperature. Sn-58Bi eutectic solder ribbon prepared by RST has finer microstructure, lower solidus temperature and more excellent wettability than that of the ribbon prepared by CRP. Therefore, the study of Sn-58Bi eutectic solder ribbon is conducive to cut cost, meet growing performance requirements, and reduce lead contamination for electronic package industry.","PeriodicalId":17101,"journal":{"name":"Journal of Residuals Science & Technology","volume":"-1 1","pages":"281-285"},"PeriodicalIF":0.0000,"publicationDate":"2017-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package\",\"authors\":\"Lan‐Lan Zhu, Shengfa Liu, W. Xiong, J. Xiong, Zhebing Hu, Chen Chen\",\"doi\":\"10.12783/ISSN.1544-8053/14/1/32\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Sn-58Bi eutectic solder ribbon was successfully prepared using an improved single-roller rapid solidification device with the optimum process parameters. The microstructure, melting behavior and wettability of Sn-58Bi eutectic solder ribbon prepared by rapid solidification technology (RST) and conventional casting-rolling process (CRP) respectively were investigated by optical microscopy (OM), differential scanning calorimetry (DSC) and wettability tests. The results show that the forming effect of solder ribbons can be obviously improved by mainly optimizing roller line speed, nozzle-to-roller spacing and heating temperature. Sn-58Bi eutectic solder ribbon prepared by RST has finer microstructure, lower solidus temperature and more excellent wettability than that of the ribbon prepared by CRP. Therefore, the study of Sn-58Bi eutectic solder ribbon is conducive to cut cost, meet growing performance requirements, and reduce lead contamination for electronic package industry.\",\"PeriodicalId\":17101,\"journal\":{\"name\":\"Journal of Residuals Science & Technology\",\"volume\":\"-1 1\",\"pages\":\"281-285\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Residuals Science & Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.12783/ISSN.1544-8053/14/1/32\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Residuals Science & Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.12783/ISSN.1544-8053/14/1/32","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

采用改进的单辊快速凝固装置,优化工艺参数,成功制备了Sn-58Bi共晶焊料带。采用光学显微镜(OM)、差示扫描量热法(DSC)和润湿性试验研究了快速凝固技术(RST)和常规铸轧工艺(CRP)制备的Sn-58Bi共晶焊料带的显微组织、熔化行为和润湿性。结果表明,通过优化辊速、喷嘴与辊间距和加热温度,可以明显改善焊带的成形效果。RST制备的Sn-58Bi共晶焊点带比CRP制备的焊点带具有更细的组织、更低的固相温度和更优异的润湿性。因此,研究Sn-58Bi共晶焊料带有利于电子封装行业降低成本,满足日益增长的性能要求,减少铅污染。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package
Sn-58Bi eutectic solder ribbon was successfully prepared using an improved single-roller rapid solidification device with the optimum process parameters. The microstructure, melting behavior and wettability of Sn-58Bi eutectic solder ribbon prepared by rapid solidification technology (RST) and conventional casting-rolling process (CRP) respectively were investigated by optical microscopy (OM), differential scanning calorimetry (DSC) and wettability tests. The results show that the forming effect of solder ribbons can be obviously improved by mainly optimizing roller line speed, nozzle-to-roller spacing and heating temperature. Sn-58Bi eutectic solder ribbon prepared by RST has finer microstructure, lower solidus temperature and more excellent wettability than that of the ribbon prepared by CRP. Therefore, the study of Sn-58Bi eutectic solder ribbon is conducive to cut cost, meet growing performance requirements, and reduce lead contamination for electronic package industry.
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来源期刊
Journal of Residuals Science & Technology
Journal of Residuals Science & Technology 环境科学-工程:环境
自引率
0.00%
发文量
0
审稿时长
>36 weeks
期刊介绍: The international Journal of Residuals Science & Technology (JRST) is a blind-refereed quarterly devoted to conscientious analysis and commentary regarding significant environmental sciences-oriented research and technical management of residuals in the environment. The journal provides a forum for scientific investigations addressing contamination within environmental media of air, water, soil, and biota and also offers studies exploring source, fate, transport, and ecological effects of environmental contamination.
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