Satyajit Shinde, Chee Huei Chan, Marcus Minchew, Lawrence Mbonu
{"title":"扩散炉LPCVD氮化过程动态行为的创新方法:设备优化/先进过程控制/无污染制造","authors":"Satyajit Shinde, Chee Huei Chan, Marcus Minchew, Lawrence Mbonu","doi":"10.1109/ASMC49169.2020.9185301","DOIUrl":null,"url":null,"abstract":"Nitride film LPCVD (Low Pressure Chemical Vapor Deposition) process is well known in semiconductor industry. The paper covers an innovative approach in touching two aspects of improvement in LPCVD nitride process in diffusion furnace. First is the extension of quartz life use by implementation of unique LTP (Low Temperature Purge) without affecting particle performance. Secondly, the impact of extended quartz life on the wafer uniformity across the different zones and methodology to compensate it.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"52 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Innovative Approach on Dynamic Behavior of LPCVD Nitride Process on Diffusion Furnace : Equipment Optimization/Advanced Process Control/Contamination Free Manufacturing\",\"authors\":\"Satyajit Shinde, Chee Huei Chan, Marcus Minchew, Lawrence Mbonu\",\"doi\":\"10.1109/ASMC49169.2020.9185301\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nitride film LPCVD (Low Pressure Chemical Vapor Deposition) process is well known in semiconductor industry. The paper covers an innovative approach in touching two aspects of improvement in LPCVD nitride process in diffusion furnace. First is the extension of quartz life use by implementation of unique LTP (Low Temperature Purge) without affecting particle performance. Secondly, the impact of extended quartz life on the wafer uniformity across the different zones and methodology to compensate it.\",\"PeriodicalId\":6771,\"journal\":{\"name\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"52 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC49169.2020.9185301\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185301","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Innovative Approach on Dynamic Behavior of LPCVD Nitride Process on Diffusion Furnace : Equipment Optimization/Advanced Process Control/Contamination Free Manufacturing
Nitride film LPCVD (Low Pressure Chemical Vapor Deposition) process is well known in semiconductor industry. The paper covers an innovative approach in touching two aspects of improvement in LPCVD nitride process in diffusion furnace. First is the extension of quartz life use by implementation of unique LTP (Low Temperature Purge) without affecting particle performance. Secondly, the impact of extended quartz life on the wafer uniformity across the different zones and methodology to compensate it.
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