应变硅:工程衬底和器件集成

M. T. Currie
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引用次数: 0

摘要

在国际半导体技术路线图中,应变硅正在成为晶体管性能持续发展的关键技术。本文综述了应变硅的基本原理,以及优化应变硅衬底的结构。讨论了强调材料质量和经济加工的衬底制造准则。描述了衬底结构对应变硅器件性能和集成度的影响。本文还介绍了一种基于应变硅衬底的新型结构——应变硅绝缘体。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Strained silicon: engineered substrates and device integration
Strained Si is emerging as a technology vital to the continued progression of transistor performance laid out in the International Technology Roadmap for Semiconductors. Strained Si fundamentals are reviewed, as is the structure of optimized strained Si substrates. Substrate fabrication guidelines that emphasize material quality and economic processing are discussed. The impact of the substrate structure on strained Si device performance and integration is described. Strained-Si-on-Insulator, an advanced structure derived from strained Si substrates, is also introduced.
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