含金属杂质碳化硼的正电子光谱

Chan Liu
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引用次数: 7

摘要

采用碳化硼粉末(b4.3 C)和0.5 ~ 1 at%金属(Zr或V)的热压混合制备了掺杂金属的碳化硼(b4.3 C)半导体,研究了掺杂杂质对b4.3 C晶体细微结构和电导率的影响。正电子寿命谱、x射线衍射和多普勒展宽分析表明,适当的金属引入可以改变b4.3 C的结构。特别是在链中心的B(3)位上引入了明显的空位。同时,b4.3 C晶格胞沿C轴略有收缩。没有发现电导率的明显变化伴随着结构的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Positron Spectroscopy of Boron Carbide Containing Metal Impurity
Boron carbide (B 4.3 C) semiconductors with metal incorporation were prepared by hot pressing mixtures of boron carbide powder (B 4.3 C) and 0.5 ∼ 1 at% metal (Zr or V). The influences of impurity incorporation on the subtle structure and conductivity of B 4.3 C crystals were investigated. Positron lifetime spectrum, x-ray diffraction and Doppler-broadening analyses indicate that appropriate metal introduction can modify the B 4.3 C structure. Especially, noticeable vacancies are introduced into about the B(3) sites at the chain centers. Meanwhile, the B 4.3 C lattice cell contracts a little along the c axis. No distinctive change of the electrical conductivity is found to accompany the structural change.
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