跌落试验模拟的无铅焊料循环塑性表征

E. Bonnaud, P. Gudmundson
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引用次数: 3

摘要

对无铅焊料的力学行为进行了实验研究,并建立了分析模型。不同应变率单轴循环加载下的材料试件表现出明显的粘塑性、循环内非线性混合硬化、循环间先硬化后软化等特性。为了准确地描述这些行为,将一个改进的Armstrong和Fredrick模型与Perzyna粘塑性演化方程结合起来。参数集是通过曲线拟合和利用解析关系确定的
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations
Mechanical behaviour of lead-free solder has been investigated experimentally and thereafter modelled analytically. Material test specimens subjected to uniaxial cyclic loadings at different strain rates exhibit noticeable properties: viscoplasticity, nonlinear mixed hardening within each cycle and hardening followed by softening between consecutive cycles. To accurately describe these behaviours, a modified Armstrong and Fredrick model was combined to the Perzyna viscoplastic evolution equation. The set of parameters was determined by both curve-fitting and use of analytical relations
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