用于亚毫米波频率下mHEMT器件大信号表征的原位负载拉式MMIC

L. John, M. Ohlrogge, S. Wagner, C. Friesicke, A. Tessmann, A. Leuther, T. Zwick
{"title":"用于亚毫米波频率下mHEMT器件大信号表征的原位负载拉式MMIC","authors":"L. John, M. Ohlrogge, S. Wagner, C. Friesicke, A. Tessmann, A. Leuther, T. Zwick","doi":"10.1109/MWSYM.2018.8439391","DOIUrl":null,"url":null,"abstract":"An in situ load-pull MMIC with preamplifier and tunable output matching network in a 35 nm InAlAs/InGaAs technology is presented in this paper. The load impedance tuning is realized using an open-circuit stub network with shunt-FETs. The tunable load impedance range and the large-signal characterization of a 2×15 μm device is demonstrated at 300 GHz. With this MMIC the unique characterization and large-signal model validation of mHEMT devices at sub-mm wave frequencies is possible. The total chip area required for large-signal characterization of a single device is 1850 μm × 400 μm.","PeriodicalId":6675,"journal":{"name":"2018 IEEE/MTT-S International Microwave Symposium - IMS","volume":"18 1","pages":"761-764"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"In situ Load- Pull MMIC for Large-Signal Characterization of mHEMT Devices at Submillimeter- Wave Frequencies\",\"authors\":\"L. John, M. Ohlrogge, S. Wagner, C. Friesicke, A. Tessmann, A. Leuther, T. Zwick\",\"doi\":\"10.1109/MWSYM.2018.8439391\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An in situ load-pull MMIC with preamplifier and tunable output matching network in a 35 nm InAlAs/InGaAs technology is presented in this paper. The load impedance tuning is realized using an open-circuit stub network with shunt-FETs. The tunable load impedance range and the large-signal characterization of a 2×15 μm device is demonstrated at 300 GHz. With this MMIC the unique characterization and large-signal model validation of mHEMT devices at sub-mm wave frequencies is possible. The total chip area required for large-signal characterization of a single device is 1850 μm × 400 μm.\",\"PeriodicalId\":6675,\"journal\":{\"name\":\"2018 IEEE/MTT-S International Microwave Symposium - IMS\",\"volume\":\"18 1\",\"pages\":\"761-764\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE/MTT-S International Microwave Symposium - IMS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2018.8439391\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE/MTT-S International Microwave Symposium - IMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2018.8439391","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

提出了一种35 nm InAlAs/InGaAs技术的带前置放大器和可调输出匹配网络的负载-拉式原位MMIC。负载阻抗调谐是通过带并联场效应管的开路存根网络实现的。在300 GHz下,演示了2×15 μm器件的负载阻抗可调范围和大信号特性。有了这个MMIC,可以在亚毫米波频率下对mHEMT器件进行独特的表征和大信号模型验证。单器件大信号表征所需的总芯片面积为1850 μm × 400 μm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
In situ Load- Pull MMIC for Large-Signal Characterization of mHEMT Devices at Submillimeter- Wave Frequencies
An in situ load-pull MMIC with preamplifier and tunable output matching network in a 35 nm InAlAs/InGaAs technology is presented in this paper. The load impedance tuning is realized using an open-circuit stub network with shunt-FETs. The tunable load impedance range and the large-signal characterization of a 2×15 μm device is demonstrated at 300 GHz. With this MMIC the unique characterization and large-signal model validation of mHEMT devices at sub-mm wave frequencies is possible. The total chip area required for large-signal characterization of a single device is 1850 μm × 400 μm.
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