用维普兰南丹模型表征丁苯改性智能水泥的质量控制、养护以及控制和检测失液和气体泄漏

C. Vipulanandan, G. Panda, A. Maddi, G. K. Wong, Ahmed Aldughather
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引用次数: 0

摘要

在这项研究中,将市售的高达3%的丁苯橡胶(SBR)聚合物添加到高传感化学-热-压阻智能水泥中,水灰比为0.38,以研究对传感性能的影响。通过一系列的质量控制、养护和高压高温(HPHT)试验来评价添加和不添加SBR聚合物的智能水泥的性能。添加1%和3%的SBR聚合物可使初始电阻率分别提高4%和12%,因此该参数可用于现场质量控制。采用Vipulanandan p-q固化模型预测了电阻率随固化时间的变化。掺入1%和3% SBR聚合物的智能水泥在养护1 d后的抗压强度分别提高了18%和32%,在养护1 d后,SBR聚合物的压阻率比普通水泥0.2%的破坏应变提高了500倍以上(5000%)。Vipulanandan p-q压电阻率模型也能很好地预测实验结果。SBR聚合物的加入减少了固化后30分钟和24小时的失液量。采用Vipulanandan失液模型预测失液量,并将其与API模型进行比较。加SBR聚合物和不加SBR聚合物的智能水泥在初始浆态和固化后都能检测到气体泄漏。SBR聚合物的加入减少了气体泄漏。在气体泄漏过程中,压阻型智能水泥浆的电阻率变化为正,而固体型智能水泥浆的电阻率变化为负。在智能水泥浆气体泄漏过程中,电阻率增加约45%,当压力梯度为2000 psi/ft时,加入3% SBR聚合物,电阻率增加约30%。在智能水泥固化过程中,气体泄漏时,其电阻率下降了约30%,与压阻响应相反,当压力梯度为2000 psi/ft时,加入3% SBR聚合物,其电阻率降至12%。采用广义达里定律的Vipulanandan流体流动模型预测了气体泄漏速度(单位面积流量)对施加压力梯度的非线性响应。电阻率变化也可用于预测含SBR聚合物和不含SBR聚合物的智能水泥中的气体泄漏速度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterizing Smart Cement Modified with Styrene Butadiene Polymer for Quality Control, Curing and to Control and Detect Fluid Loss and Gas Leaks Using Vipulanandan Models
In this study, commercially available styrene butadiene rubber (SBR) polymer up to 3% was added to the highly sensing chemo-thermo-piezoresistive smart cement with a water-to-cement ratio of 0.38 to investigate the effects on the sensing properties. Series of quality control, curing and high pressure high temperature (HPHT) experiments were performed to evaluate the smart cement behavior with and without the SBR polymer. Addition of 1% and 3% SBR polymer increased the initial resistivity by 4% and 12% respectively and hence this parameter can be used for quality control in the field. Vipulanandan p-q curing model was used to predict the changes in resistivity with curing time. Addition of 1% and 3% SBR polymer also increased the compressive strength of the smart cement by 18% and 32% after 1 day of curing respectively, The piezoresistivity of smart cement with the addition of SBR polymer after 1 day of curing was over 500 times (50,000%) higher than the regular cement failure strain of 0.2%. The Vipulanandan p-q piezoresistivity model also predicted the experimental results very well. Addition of SBR polymer reduced the fluid losses 30 minutes and 24 hours after curing. The fluid loss was predicted using the Vipulanandan fluid loss model and compared it to the API model. The smart cement with and without SBR polymer detected the gas leak during initial slurry condition and after solidification. Addition of SBR polymer reduced the gas leak. During the gas leak in the piezoresisitive smart cement slurry the resistivity change was positive and for the solid smart cement the resistivity change was negative. During gas leak in the smart cement slurry the resistivity increase was about 45% and it reduced to 30% with the addition of 3% SBR polymer at pressure gradient of 2000 psi/ft. During gas leak in the solidified smart cement the resistivity reduced, opposite to the piezoresistive response to compressive stress, by about 30% and it reduced to 12% with the addition of 3% SBR polymer at a pressure gradient of 2000 psi/ft. Vipulanandan fluid flow model, generalized Dary's Law, predicted the non-linear responses of gas leak velocity (discharge per unit area) to the applied pressure gradient. Also electrical resistivity changes can be used to predict the gas leak velocity in the smart cement with and without SBR polymer.
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