金属-绝缘体-半导体互连的精确模型

Gaofeng Wang, X. Qi, Zhiping Yu, R. Dutton
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引用次数: 0

摘要

在器件级仿真的基础上,建立了金属-绝缘体-半导体(MIS)互连的精确非线性电路模型。器件级仿真给出了场-载流子相互作用、半导体衬底损耗和非线性以及载流子的慢波效应、外偏置效应和屏蔽效应的详细信息。该模型由模拟实际MIS互连的能量传输特性的等效传输线组成,并提供适用于小信号和大信号分析的广义非线性和电子可调谐电路模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Accurate model of metal-insulator-semiconductor interconnects
An accurate nonlinear circuit model for metal-insulator-semiconductor (MIS) interconnects is presented based on a device level simulation. The device level simulation gives detailed information regarding field-carrier interactions, semiconductor substrate loss and nonlinearity, as well as slow-wave effect, external bias effect and screening effect of the charged carriers. This model consists of an equivalent transmission line that mimics the energy transport characteristics of the actual MIS interconnect, and provides a generalized nonlinear and electronic tunable circuit model suitable for both small-signal and large-signal analyses.
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