丝网印刷p+多晶硅/氧化物钝化接触以提高p- perc电池效率的定量理解和实现

Wook-Jin Choi, Aditi Jain, Ying-Yuan Huang, Y. Ok, A. Rohatgi
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引用次数: 0

摘要

本文报道了PERC后部p-TOPCon(隧道氧化物钝化触点)的建模、优化和实现,以提高其电池效率。将传统PERC的局部Al-BSF替换为由~15Å厚的化学生长隧道氧化物组成的p+多晶硅/氧化物钝化触点,并覆盖120-250nm厚的LPCVD生长的p+多晶硅层。工艺优化后,平面表面的全面积非金属化复合电流密度(J0b, pass) < 5fA/cm2,几乎与多晶硅厚度无关。金属化的Jo随着多晶硅厚度的减小而增加,在250nm和120nm的多晶硅中分别达到9.6和25fA/cm2,金属- si直接接触分数为4.6%,适合双面电池。制作了具有局部BSF的21.4%基线PERC电池,并对其进行了表征,提取了65fA/cm2的后部重组电流密度(J0b,)。详细的分析和器件仿真表明,用本研究开发的250nm TOPCon代替该LBSF,可产生9.2mV的Voc增强,与观察到的细胞Voc增加10mV一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Quantitative Understanding and Implementation of Screen Printed p+ Poly-Si/Oxide Passivated Contact to Enhance the Efficiency of p-PERC Cells
This paper reports on the modeling, optimization, and implementation of p-TOPCon (tunnel oxide passivating contacts) on the rear side of a PERC to enhance its cell efficiency. Local Al-BSF of a traditional PERC was replaced by p+ poly-Si/oxide passivated contact composed of ~15Å thick chemically grown tunnel oxide, capped with 120-250nm thick p+ poly-Si layer grown by LPCVD. Process optimization resulted in full-area un-metallized recombination current density (J0b, pass) of < 5fA/cm2 for planar surface, nearly independent of poly-Si thickness in this range. Metallized Jo showed an increase with decreased poly-Si thickness and was found to be 9.6 and 25fA/cm2 for 250nm and 120nm poly-Si respectively, with 4.6% direct metal-Si contact fraction, suitable for bifacial cells. A 21.4% baseline PERC cell with local BSF was fabricated and characterized to extract the rear side recombination current density (J0b,) of 65fA/cm2. Detailed analysis and device simulation showed that by replacing this LBSF with 250nm TOPCon developed in the study should produce a Voc enhancement of 9.2mV, consistent with the observed cell Voc increase of 10mV.
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