了解金属在固体电解质中由于离子-电子混合传导的传播

Qingsong Tu, Tan Shi, S. Chakravarthy, G. Ceder
{"title":"了解金属在固体电解质中由于离子-电子混合传导的传播","authors":"Qingsong Tu, Tan Shi, S. Chakravarthy, G. Ceder","doi":"10.2139/ssrn.3834690","DOIUrl":null,"url":null,"abstract":"Summary Metal penetration into a solid electrolyte (SE) is one of the critical problems impeding the practical application of solid-state batteries. In this study, we investigate the conditions under which electronic conductivity of the SE can lead to metal deposition and fracture within the SE. Three different stages for void filling (metal plating initiation, metal growth, and metal compression) in the SE are identified. We show that a micron-size isolated void in the SE near the anode can be quickly filled in by metal and fractured when the developed pressure in the void grows larger than the maximum pressure the SE material can sustain. We find that the anode voltage and applied current density play a significant role in determining the vulnerability to metal deposition. We discuss several strategies to prevent electronic conductivity-driven metal propagation in electrolytes that are not fully dense, including the densified layers between the anode and SE.","PeriodicalId":10639,"journal":{"name":"Computational Materials Science eJournal","volume":"72 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-09-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Understanding Metal Propagation in Solid Electrolytes Due to Mixed Ionic–Electronic Conduction\",\"authors\":\"Qingsong Tu, Tan Shi, S. Chakravarthy, G. Ceder\",\"doi\":\"10.2139/ssrn.3834690\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary Metal penetration into a solid electrolyte (SE) is one of the critical problems impeding the practical application of solid-state batteries. In this study, we investigate the conditions under which electronic conductivity of the SE can lead to metal deposition and fracture within the SE. Three different stages for void filling (metal plating initiation, metal growth, and metal compression) in the SE are identified. We show that a micron-size isolated void in the SE near the anode can be quickly filled in by metal and fractured when the developed pressure in the void grows larger than the maximum pressure the SE material can sustain. We find that the anode voltage and applied current density play a significant role in determining the vulnerability to metal deposition. We discuss several strategies to prevent electronic conductivity-driven metal propagation in electrolytes that are not fully dense, including the densified layers between the anode and SE.\",\"PeriodicalId\":10639,\"journal\":{\"name\":\"Computational Materials Science eJournal\",\"volume\":\"72 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Computational Materials Science eJournal\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2139/ssrn.3834690\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Computational Materials Science eJournal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2139/ssrn.3834690","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

摘要

金属在固体电解质中的渗透是阻碍固态电池实际应用的关键问题之一。在这项研究中,我们研究了SE的电子导电性导致SE内金属沉积和断裂的条件。在SE中确定了三个不同的空隙填充阶段(金属镀层起始、金属生长和金属压缩)。我们发现,在靠近阳极的SE中,一个微米大小的孤立空洞可以被金属快速填充并破裂,当空洞中的发展压力大于SE材料所能承受的最大压力时。我们发现阳极电压和外加电流密度在决定金属沉积易损性方面起着重要作用。我们讨论了几种防止电子电导率驱动的金属在不完全致密的电解质中传播的策略,包括阳极和SE之间的致密层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding Metal Propagation in Solid Electrolytes Due to Mixed Ionic–Electronic Conduction
Summary Metal penetration into a solid electrolyte (SE) is one of the critical problems impeding the practical application of solid-state batteries. In this study, we investigate the conditions under which electronic conductivity of the SE can lead to metal deposition and fracture within the SE. Three different stages for void filling (metal plating initiation, metal growth, and metal compression) in the SE are identified. We show that a micron-size isolated void in the SE near the anode can be quickly filled in by metal and fractured when the developed pressure in the void grows larger than the maximum pressure the SE material can sustain. We find that the anode voltage and applied current density play a significant role in determining the vulnerability to metal deposition. We discuss several strategies to prevent electronic conductivity-driven metal propagation in electrolytes that are not fully dense, including the densified layers between the anode and SE.
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