MoS2晶体在与Au薄膜接触的Ni通道上优先生长

Neha Kondekar, Pralav P. Shetty, Lan Ho, Yi Li, Matthew P. West, M. McDowell
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引用次数: 0

摘要

我们报道了基于MoO3和S前驱体的传统MoS2 CVD在Ni薄膜上选择性生长,而在Au薄膜和SiO2/Si薄膜上抑制生长。这使得晶体MoS2的选择性生长具有精确的空间控制和大面积的可重复性,具有最佳的前驱体递送,对于MoS2器件的大规模制造至关重要。这种选择性生长被认为是由于Ni/Au/SiO2表面表面能的差异。接触角测量结果表明,Ni薄膜的接触角比Au或SiO2更小,亲水性更强。先前的研究表明,低浓度的Ni会导致MoS2颗粒的形成,这有助于MoS2在图案Ni通道上的生长。正在进行的工作探索选择性蚀刻底层Ni薄膜的可能性,以使用这些图像化的Au/MoS2薄膜作为FET器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preferential growth of crystalline MoS2 on patterned Ni channels in contact with Au thin films
We report selective growth of few-layered, crystalline MoS2 on Ni thin films while inhibiting growth on Au thin films and SiO2/Si when using conventional MoS2 CVD based on MoO3 and S precursors. This allows for selective growth of crystalline MoS2 with precise spatial control and repeatability across large areas with optimal precursor delivery and is critical to large-scale manufacturing of MoS2 devices. This selective growth is postulated to be due to differences in surface energy of the Ni/Au/SiO2 surfaces. Contact angle measurements show that Ni thin films have a lower contact angle and are more hydrophilic than Au or SiO2. Previous studies have shown that low concentrations of Ni result in formation of larger grains of MoS2, aiding the growth of MoS2 on patterned Ni channels. Ongoing work explores the possibility of selectively etching the underlying Ni thin films to use these patterned Au/MoS2 thin films as FET devices.
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