一种新的三维多层微结构制备方法

2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2006-01-01 DOI:10.1109/NEMS.2006.334846

X. Jing, Di Chen, Baozeng Zhang, Jingquan Liu, Jun Zhu

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引用次数: 0

摘要

提出了一种实现三维多层微结构的新方法。它包括两大工艺:硅蚀刻工艺和UV-LIGA工艺。通过这种方式，单一技术的一些形状限制可以克服新的功能。通过结合这些工艺，可以制作多层结构和复杂图形。为了实现良好的结合，研究了SU-8光刻胶与蚀刻硅衬底表面的粘接特性。还采用了两个步骤，可以彻底去除蚀刻硅槽中的气泡。为了证明这种微加工工艺的结合，在蚀刻硅槽中成功地制造了一些SU-8微结构。该方法在多层微结构制造中具有一定的应用价值

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A New Fabrication Method for 3D Multilayer Microstructure

A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics between the SU-8 photoresist and the surface of etched silicon substrate was studied. Two steps that can thoroughly remove bubbles in the etched silicon groove are also employed. To demonstrate this combination of micro fabrication process, some SU-8 microstructures are successfully fabricated in the etched silicon grooves. This method has applications in multi-layer microstructure fabrication

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2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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