纯、纳米填充和微填充聚醚酰亚胺树脂直流介电强度的测量和建模

2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena Pub Date : 2011-10-01 DOI:10.1109/CEIDP.2011.6232761

D. Mary, D. Malec, M. Q. Nguyen, P. Werynski, B. Gornicka

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引用次数: 0

摘要

本文描述并分析了纯PEI清漆、纳米级填充PEI清漆和微级填充PEI清漆直流击穿强度的结果。二氧化硅(10nm和400nm)已被用作填充物，以增加这些清漆提交到部分放电活动的寿命(清漆用于由逆变器供电的旋转机器)。实验结果表明，填料对介质的介电强度和导电电流均有影响。传导电流越大，直流击穿强度越低。因此，建模集中在热击穿理论上，以解释这些实验数据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Measurement and modelling of the DC dielectric strength of pure, nanofilled and microfilled polyetherimide resin

Results of DC breakdown strength of pure, nanoscale-filled and microscale-filled PEI varnishes are described and analyzed in this communication. Silica (10nm and 400nm) has been used as a filler to increase the lifetime of such varnishes submitted to a partial discharge activity (varnish to be used in rotating machines fed by inverters). Experimental results have shown that both dielectric strength and conduction current are affected by the fillers. The higher the conduction current, the lower the DC breakdown strength. The modelling has consequently been focused on the thermal breakdown theory to explain these experimental data.

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2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena

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