L. Teodorescu, A. Gheorghe, F. Draghici, G. Brezeanu, I. Rusu
{"title":"高温卡盘系统的电源结构","authors":"L. Teodorescu, A. Gheorghe, F. Draghici, G. Brezeanu, I. Rusu","doi":"10.1109/SMICND.2014.6966432","DOIUrl":null,"url":null,"abstract":"A supply technique used for an electric heating resistor mounted inside a thermal chuck system which supports wafer testing in high temperatures domain is described in this paper. Following this technique, a platform for low noise wafer measurements may be develop.","PeriodicalId":6616,"journal":{"name":"2014 International Semiconductor Conference (CAS)","volume":"92 1","pages":"193-196"},"PeriodicalIF":0.0000,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Power supply architecture for high temperature chuck systems\",\"authors\":\"L. Teodorescu, A. Gheorghe, F. Draghici, G. Brezeanu, I. Rusu\",\"doi\":\"10.1109/SMICND.2014.6966432\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A supply technique used for an electric heating resistor mounted inside a thermal chuck system which supports wafer testing in high temperatures domain is described in this paper. Following this technique, a platform for low noise wafer measurements may be develop.\",\"PeriodicalId\":6616,\"journal\":{\"name\":\"2014 International Semiconductor Conference (CAS)\",\"volume\":\"92 1\",\"pages\":\"193-196\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 International Semiconductor Conference (CAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2014.6966432\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Semiconductor Conference (CAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2014.6966432","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power supply architecture for high temperature chuck systems
A supply technique used for an electric heating resistor mounted inside a thermal chuck system which supports wafer testing in high temperatures domain is described in this paper. Following this technique, a platform for low noise wafer measurements may be develop.