基于STI的LDMOS新型栅极结构设计

Ziquan Fang, Zhaozhao Xu, W. Qian
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引用次数: 0

摘要

传统的基于STI的LDMOS器件总是有一个扩展栅极,作为STI顶部的聚极板。在本文中,我们提出了一种新的LDMOS栅极结构,栅极与STI之间没有重叠。相反,触点落在STI上作为板执行,以获得高的断开状态击穿电压(offBV)。该新型LDMOS兼容CMOS工艺,且offBV可达20V以上,无需额外漂移植入掩模。TCAD仿真用于解释所提出的新体系结构的底层物理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Gate Architecture Design in STI Based LDMOS
Conventional STI based LDMOS devices always have an extended gate which performs as a poly plate on top of the STI. In this paper, we have proposed a novel LDMOS gate architecture with no overlap between gate and STI. Instead, the contacts landing on the STI perform as plate to obtain high off-state breakdown voltage (offBV). The novel LDMOS is compatible with CMOS process, and the offBV can be above 20V without additional drift implant mask. TCAD simulation is used to explain the underlying physics of the proposed novel architecture.
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