M. Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, S. Yamasaki, M. Mitsuhara, H. Nakashima
{"title":"Cu和Ni加入对Sn-Cu-Ni钎料合金高温变形行为的影响","authors":"M. Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, S. Yamasaki, M. Mitsuhara, H. Nakashima","doi":"10.2320/JINSTMET.J2016069","DOIUrl":null,"url":null,"abstract":"In recent years, it has become necessary to develop lead substitutes, such as lead–free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead–free solder alloys will need to be smaller and usable at higher operating temperatures in next–generation semiconductor devices. Therefore, lead–free solder alloys must be made more reliable. In this work, tin–copper–nickel (Sn–Cu–Ni) solder alloys, Sn–Cu solder alloys, and Sn–Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high–temperature deformation behavior of the Sn–Cu–Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be >5. This result indicated that, in each sample, the high–temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu. [doi:10.2320/jinstmet.J2016069]","PeriodicalId":17337,"journal":{"name":"Journal of The Japan Institute of Metals","volume":"37 1","pages":"337-344"},"PeriodicalIF":0.5000,"publicationDate":"2017-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys\",\"authors\":\"M. Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, S. Yamasaki, M. Mitsuhara, H. Nakashima\",\"doi\":\"10.2320/JINSTMET.J2016069\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In recent years, it has become necessary to develop lead substitutes, such as lead–free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead–free solder alloys will need to be smaller and usable at higher operating temperatures in next–generation semiconductor devices. Therefore, lead–free solder alloys must be made more reliable. In this work, tin–copper–nickel (Sn–Cu–Ni) solder alloys, Sn–Cu solder alloys, and Sn–Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high–temperature deformation behavior of the Sn–Cu–Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be >5. This result indicated that, in each sample, the high–temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu. [doi:10.2320/jinstmet.J2016069]\",\"PeriodicalId\":17337,\"journal\":{\"name\":\"Journal of The Japan Institute of Metals\",\"volume\":\"37 1\",\"pages\":\"337-344\"},\"PeriodicalIF\":0.5000,\"publicationDate\":\"2017-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of The Japan Institute of Metals\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.2320/JINSTMET.J2016069\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"METALLURGY & METALLURGICAL ENGINEERING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of The Japan Institute of Metals","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.2320/JINSTMET.J2016069","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
引用次数: 0
摘要
近年来,由于使用含铅材料引起的环境问题日益严重,有必要开发铅替代品,例如无铅焊料合金。此外,在下一代半导体器件中,使用无铅焊料合金的电子元件需要更小,并能在更高的工作温度下使用。因此,必须使无铅焊料合金更加可靠。本文对锡-铜-镍(Sn - cu - ni)钎料合金、Sn - cu钎料合金和Sn - ni钎料合金以及99.96质量%纯锡进行了拉伸试验。结果表明,在Sn中加入Cu和Ni对Sn - Cu - Ni钎料合金的高温变形行为有影响。各合金和Sn的应力指数均大于5。结果表明,各试样的高温变形均受位错蠕变控制。蠕变活化能与应力有关,其中Cu对蠕变活化能的影响最大。(doi: 10.2320 / jinstmet.J2016069)
Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys
In recent years, it has become necessary to develop lead substitutes, such as lead–free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead–free solder alloys will need to be smaller and usable at higher operating temperatures in next–generation semiconductor devices. Therefore, lead–free solder alloys must be made more reliable. In this work, tin–copper–nickel (Sn–Cu–Ni) solder alloys, Sn–Cu solder alloys, and Sn–Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high–temperature deformation behavior of the Sn–Cu–Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be >5. This result indicated that, in each sample, the high–temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu. [doi:10.2320/jinstmet.J2016069]