考虑不匹配诱导应力和材料孔隙率提高元件密度的CMOS功率放大器工艺优化

International Journal of Online Engineering Pub Date : 2018-01-30 DOI:10.5121/IJOE.2018.7101

P. E.L

{"title":"考虑不匹配诱导应力和材料孔隙率提高元件密度的CMOS功率放大器工艺优化","authors":"P. E.L","doi":"10.5121/IJOE.2018.7101","DOIUrl":null,"url":null,"abstract":"In this paper we introduce an approach to increase density of field-effect transistors framework a CMOS power amplifier. Framework the approach we consider manufacturing the inverter in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should by annealed framework optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress.","PeriodicalId":14375,"journal":{"name":"International Journal of Online Engineering","volume":"75 1","pages":"01-15"},"PeriodicalIF":0.0000,"publicationDate":"2018-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On Optimization of Manufacturing of a CMOS Power Amplifier to Increase Density of Elements with Account Miss-Match Induced Stress and Porosity of Materials\",\"authors\":\"P. E.L\",\"doi\":\"10.5121/IJOE.2018.7101\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we introduce an approach to increase density of field-effect transistors framework a CMOS power amplifier. Framework the approach we consider manufacturing the inverter in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should by annealed framework optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress.\",\"PeriodicalId\":14375,\"journal\":{\"name\":\"International Journal of Online Engineering\",\"volume\":\"75 1\",\"pages\":\"01-15\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Online Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.5121/IJOE.2018.7101\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Online Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5121/IJOE.2018.7101","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文介绍了一种提高CMOS功率放大器结构场效应晶体管密度的方法。在此框架下，我们考虑了在异质结构中制造具有特定构型的逆变器的方法。异质结构的一些需要的区域应该通过扩散或离子注入进行掺杂。然后对掺杂和辐射缺陷采用退火框架优化方案。我们还考虑了一种减小异质结构中错配应力值的方法。本文介绍了一种分析集成电路制造过程中不匹配应力引起的异质结构质量和热量传递的分析方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

On Optimization of Manufacturing of a CMOS Power Amplifier to Increase Density of Elements with Account Miss-Match Induced Stress and Porosity of Materials

In this paper we introduce an approach to increase density of field-effect transistors framework a CMOS power amplifier. Framework the approach we consider manufacturing the inverter in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should by annealed framework optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

International Journal of Online Engineering COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS-

自引率

0.00%

发文量

审稿时长

12 weeks

期刊介绍： We would like to inform you, that iJOE, the ''International Journal of Online Engineering'' will accept now also papers in the field of Biomedical Engineering and e-Health''. iJOE will therefore be published from January 2019 as the ''International Journal of Online and Biomedical Engineering''. The objective of the journal is to publish and discuss fundamentals, applications and experiences in the fields of Online Engineering (remote engineering, virtual instrumentation and online simulations, etc) and Biomedical Engineering/e-Health. The use of cyber-physical systems, virtual and remote controlled devices and remote laboratories are the directions for advanced teleworking/e-working environments. In general, online engineering is a future trend in engineering and science. Due to the growing complexity of engineering tasks, more and more specialized and expensive equipment as well as software tools and simulators, shortage of highly qualified staff, and the demands of globalization and collaboration activities, it become essential to utilize cyber cloud technologies to maximize the use of engineering resources. Online engineering is the way to address these issues. Considering these, one focus of the International Journal of Online and Biomedical Engineering is to provide a platform to publish fundamentals, applications and experiences in the field of Online Engineering, for example: Remote Engineering Internet of Things Cyber-physical Systems Digital Twins Industry 4.0 Virtual Instrumentation. An important application field of online engineering tools and principles are Biomedical Engineering / e-Health. Topics we are interested to publish are: Automation Technology for Medical Applications Big Data in Medicine Biomedical Devices Biosensors Biosignal Processing Clinical Informatics Computational Neuroscience Computer-Aided Surgery.