625合金轧制前后电阻率、维氏硬度和显微组织的比较研究

T. Nagata, K. Takeda, H. Adachi, K. Ishikawa, Y. Miyajima
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引用次数: 1

摘要

对625合金冷轧后的电阻率和维氏硬度进行了测定,并利用电子背散射衍射和X射线衍射分析了试样的显微组织变化。同时观察到位错密度的增加和晶粒的细化。普通纯金属的电阻率随着轧制压下量的增加而增加,而625合金的电阻率在轧制压下量增加70%时开始下降。随着轧制压下量的增加,电阻率略有增加,达到80%。在滚压降低70%之前,电阻率的降低与K效应有关,这是由于塑性变形导致的短程有序畴的破坏。另一方面,随着轧制压下量的增加,维氏硬度增加。这与晶粒再细化、位错、固溶和分界有序强化的作用有关。doi: 10.2320
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Comparison Study of Electrical Resistivity, Vickers Hardness, and Microstructures of Alloy 625 Prior and Posterior to Rolling
Electrical resistivity and Vickers hardness of Alloy 625 due to cold rolling were measured, and, discussed with the microstructural change obtained using electron backscattered di ff raction and X – ray di ff raction. Both increase in dislocation density and grain subdivision due to rolling was observed. Although the electrical resistivity of the normal pure metals increases with increasing the rolling reduction, that of Alloy 625 initially decreased with increasing the rolling reduction of 70 % . Then, the electrical resistivity slightly increased with increasing the rolling reduction of 80 % . Up to the rolling reduction of 70 % , the reduction of electrical resistivity is associated with K e ff ect, which is the destroy of the short – range ordered domain due to the plastic deformation. On the other hand, Vickers hardness increased with increasing the rolling reduction. It was associated with the contribution of grain re fi nement, dislocation, solid solution, and sort – range order strengthening. doi:10.2320
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