Ye Liang, Yuanlei Zhang, Yutao Cai, Zhaoyi Wang, Yinchao Zhao, H. Wen, Wen Liu
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引用次数: 2
摘要
本文研究了24 nm ALD-Al2O3栅极介质的d模miss - hemt。研究了室温下栅应力阶段和恢复阶段的阈值电压(Vth)、漏极电流(Ids)、导通电阻(Ron)、亚阈值摆幅(SS)和栅漏电流(Ileak)等电学参数。结果表明,在应力阶段,Vth和Ron为正位移,而id为负位移。这是因为通道电子被介电/ iii -氮化物界面层和栅极介电中的体阱捕获。然而,这些电气参数的变化不能在回收阶段结束时完全恢复,随后是30分钟的热脱陷。它可能是由(1)正栅极偏压引起的介电层中不可恢复的缺陷引起的。(2)散装疏水阀具有较大的发射常数。(3)通道与介质/ iii -氮化物界面层之间存在AlGaN势垒,使得电子难以交换。
Threshold Voltage Instability in D-mode AlGaN/GaN MIS-HEMTs with Al2O3 Gate Dielectric
In this paper, D-mode MIS-HEMTs with 24 nm ALD-Al2O3 gate dielectric are studied. The electrical parameters, such as threshold voltage (Vth), drain current (Ids), on-resistant (Ron), sub-threshold swing (SS), and gate leakage current (Ileak) are investigated during the gate stress phase and recovery phase at room temperature. It is found that, during the stress phase, Vth and Ron show positive shifts while Ids show negative shifts. It is because channel electrons are trapped by the dielectric/III-nitride interface layer and by the bulk traps in the gate dielectric. However, these electrical parameter changes cannot be fully recoverable at the end of the recovery phase, followed by 30 mins thermal de-trapping. It may be caused by (1) positive gate bias induced unrecoverable defects in the dielectric layer. (2) bulk trap has a relatively large emission constant. (3) AlGaN barrier exists between the channel and dielectric/III-nitride interface layer, make the electrons hard to exchanges.