Effect of chirality on the silicon-carbon nanotube thermal interface resistance

Thermal flow across the interface between two different materials is strongly affected by the differences in the electronic properties and vibrational modes of the two materials which give rise to the thermal interface resistance[1]. The thermal interface resistance results in a finite temperature discontinuity at the interface between the two materials. Reducing the thermal interface resistance between silicon chips and the packaging material is very critical for efficiently extracting heat and ensuring reliable operation of ICs. The large thermal conductivity of carbon nanotubes makes them very ideal for developing thermal switches and thermal interface materials [2]. We have investigated the thermal interface resistance between carbon nanotubes and silicon using molecular dynamic (MD) simulations.