Bi-2223薄膜上本征隧道结的特性

A. Odagawa, M. Sakai , H. Adachi , K. Setsune
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引用次数: 0

摘要

我们成功地在(Bi,Pb)2Sr2Ca2Cu3O10+x薄膜上制备了具有少量本征结的小尺寸薄层。通过射频溅射和随后的热处理,在高质量薄膜表面制备了具有结的台面结构。最薄层沿c轴的I-V特性显示为6支路结构,对应6个隧道结阵列和代表超导间隙的边缘结构。估计的超导间隙值在很大程度上依赖于制造的堆叠中结的数量。对于具有6结的薄层叠,其在4.2 K下的间隙值约为65 mV,是先前报道的本征结的两到三倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characteristics of intrinsic tunnel junctions on Bi-2223 thin films

We have successfully fabricated a small-sized thin stack with a small number of intrinsic junctions on (Bi,Pb)2Sr2Ca2Cu3O10+x thin films. Mesa structures with the junctions are fabricated on the surface of high-quality films prepared by rf-sputtering and subsequent heat treatment. IV characteristics along the c-axis for the thinnest stack show a 6-branch structure which corresponds to six tunnel junction arrays and the edge structure which represents the superconductive gap. The estimated superconductive gap values strongly depend on the number of junctions in the fabricated stack. For the thin stacks with 6-junctions, their gap values are about 65 mV at 4.2 K, which is two or three times as large as those previously reported for intrinsic junctions.

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