{"title":"专利文献中的直接键合","authors":"Jan Haisma","doi":"10.1016/0165-5817(95)82009-4","DOIUrl":null,"url":null,"abstract":"<div><p>Patent literature tells its own story of technological innovations. This story is evaluated here in the case of direct bonding. It is concluded that, on a worldwide basis, direct bonding has been approached via three avenues: optical, silicon technology and silicon wafer preparation.</p></div>","PeriodicalId":101018,"journal":{"name":"Philips Journal of Research","volume":"49 1","pages":"Pages 165-170"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0165-5817(95)82009-4","citationCount":"2","resultStr":"{\"title\":\"Direct bonding in patent literature\",\"authors\":\"Jan Haisma\",\"doi\":\"10.1016/0165-5817(95)82009-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Patent literature tells its own story of technological innovations. This story is evaluated here in the case of direct bonding. It is concluded that, on a worldwide basis, direct bonding has been approached via three avenues: optical, silicon technology and silicon wafer preparation.</p></div>\",\"PeriodicalId\":101018,\"journal\":{\"name\":\"Philips Journal of Research\",\"volume\":\"49 1\",\"pages\":\"Pages 165-170\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0165-5817(95)82009-4\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Philips Journal of Research\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/0165581795820094\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Philips Journal of Research","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0165581795820094","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Patent literature tells its own story of technological innovations. This story is evaluated here in the case of direct bonding. It is concluded that, on a worldwide basis, direct bonding has been approached via three avenues: optical, silicon technology and silicon wafer preparation.
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