聚碳酸酯基复合材料抑制电磁辐射的历程

Kumari Sushmita, Giridhar Madras, Suryasarathi Bose
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引用次数: 0

摘要

电子设备的广泛使用导致了一种新的污染形式,即电磁(EM)污染,造成设备故障等严重问题,并影响其可靠性。这篇综述文章全面介绍了用于电磁干扰(EMI)屏蔽应用的各种聚碳酸酯(PC)材料,包括 PC 基复合材料、共混复合材料、泡沫材料以及最新的多层结构。根据前十年的最新文献,纳米填料/填充物的特性(电导率、介电常数和磁导率)以及纳米复合材料的加工/制造技术显然控制着 PC 基材料的 EMI 屏蔽特性。研究人员对各种填料进行了探索,但高纵横比碳质纳米填料获得了极大关注。通过对 PC 复合材料进行形态改性,人们可以获得低至 0.021 wt% 的碳纳米管(CNT)渗流阈值。然而,导电填料的连接性越高,并不一定就能带来高 EMI 屏蔽性能。因此,本文还强调了对屏蔽机理的详细见解。这篇综述文章将帮助研究人员设计出具有优异 EMI 屏蔽性能和良好机械稳定性的 PC 基材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The journey of polycarbonate-based composites towards suppressing electromagnetic radiation

Electronic devices’ widespread usage has led to a new form of pollution, known as electromagnetic (EM) pollution, causing serious problems like equipment malfunctioning and affecting its reliability. This review article presents a comprehensive literature survey on the various polycarbonate (PC)-based materials for electromagnetic interference (EMI) shielding applications comprising of PC-based composites, blend composites, foams, and more recently, multilayered architectures. Following the state-of-the-art literature available from the previous decade, it is apparent that the properties (conductivity, permittivity and permeability) of nanofiller/fillers and nanocomposite processing/fabrication techniques control the EMI shielding properties in PC-based materials. Researchers have explored a variety of fillers, but high aspect ratio carbonaceous nanofillers have gained significant attention. Through morphological modifications of PC composites, one can obtain a percolation threshold as low as 0.021 wt% of carbon nanotubes (CNTs). However, higher connectivity of conductive filler need not necessarily lead to high EMI shielding performance. Thus, detailed insight into the shielding mechanism is also highlighted. This review article will help researchers design PC-based materials with superior EMI shielding performance coupled with good mechanical stability.

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