现场可配置的片上系统设备架构

Steven K. Knapp, D. Tavana
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引用次数: 14

摘要

市场压力、系统复杂性的增加和更小的工艺几何形状,正在创造一个市场真空,这将越来越多地由一个重要的新兴设备类别来解决:可配置系统芯片(CsoC)。这些特定于应用程序的可编程部件(ASPP)是微处理器、存储器、专用外设功能和嵌入式可编程逻辑的单芯片组合。它们为即将到来的十年的电子系统提供了前所未有的上市时间效益和现场定制。微处理器、存储器、外设和可编程逻辑的集成通过一种称为可配置系统互连总线(CSI)的新总线体系结构成为可能。可配置系统互连总线是专门设计用于促进重用,保证定时,提高系统吞吐量,并减少系统调试时间,在应用程序中需要紧张的时间到市场和现场升级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Field configurable system-on-chip device architecture
Time to market pressures, increasing system complexity, and smaller process geometries, are creating a market vacuum that will be increasingly addressed by an important emerging category of devices: the Configurable System-on-Chip (CsoC). These application specific programmable parts (ASPP) are single chip combinations of microprocessors, memory, dedicated peripheral functions, and embedded programmable logic. They provide unprecedented time-to-market benefits and field customization for the electronic systems of this upcoming decade. Integration of microprocessors, memory, peripherals, and programmable logic is made possible with a new bus architecture called the Configurable System Interconnect Bus (CSI). The Configurable System Interconnect Bus was specifically designed to facilitate re-use, guarantee timing, increase system throughput, and reduce system debug time in applications that require intense time-to-market and field upgrade.
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