片上实验室用于热处理的大面积薄膜加热器

N. Lovecchio, G. de Cesare, A. Nascetti, F. Costantini, D. Caputo
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引用次数: 1

摘要

本工作报告了一种用于实验室芯片应用的大面积薄膜加热器的开发。该器件是一种螺旋形的铬/铝/铬堆叠结构,通过微电子技术制造在$5\ × 5\text{cm}^{2}$玻璃基板上。COMSOL Multiphysics对其几何形状进行了设计和优化,包括螺距和线宽,以实现均匀的温度分布。用热像仪进行的测量显示,在5cm2面积上的温度变化低于1.5°C,与数值模拟非常吻合。据我们所知,这是在芯片实验室系统中使用单个加热器实现温度均匀性的最大区域。这为多孔DNA扩增或细胞培养等大面积热处理开辟了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Large-Area Thin Film Heater for Thermal Treatments in Lab-on-Chip
This work reports on the development of a large-area thin film heater for lab-on chip applications. The device is a chromium/aluminum/chromium stacked structure with a spiral shape fabricated on a $5\times 5\text{cm}^{2}$ glass substrate through microelectronic technologies. Its geometry has been designed and optimized by COMSOL Multiphysics in terms of pitch and line width to achieve a uniform temperature distribution. Measurements performed with a thermo-camera show temperature variation below 1.5°C over 5cm2 area in excellent agreement with numerical modeling. To our knowledge, this is the largest area with such temperature uniformity achieved with a single heater in lab-on-chip systems. This opens the route for large-area thermal treatments as multiple-well DNA amplification or cell culture.
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