利用1064nm激光对氧化铟锡薄膜进行微细加工

K. Tu, C. Chung
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引用次数: 0

摘要

本文报道了采用1064 nm Nd:YVO4激光直接写入氧化铟锡(ITO)薄膜的微图形加工并对其进行电铸的实验和分析结果。与传统的光刻和蚀刻技术相比,在适当的控制下使用Nd:YVO4激光直接写入ITO微图案可以获得高质量的表面,而无需大量的加工步骤。利用衍射倍数Nd:YVO4光束,可以在不破坏玻璃结构的情况下去除ITO薄膜。激光刻划完成后,利用激光光斑高度重叠的区域在薄膜表面刻划电极层,获得精细的烧蚀边缘轮廓。因此,可以使用电铸和通过激光图案ITO薄膜的释放工艺获得微部件。新的微零件加工是一种无掩膜、干燥和低成本的工艺,取代了复杂的光刻、溅射和牺牲层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Selective patterning of indium tin oxide films using 1064 nm laser for micro parts processing
We report the experimental and analysis results of micro parts processing using 1064 nm Nd:YVO4 laser direct-write micro patterning of indium tin oxide (ITO) thin films and then followed by electroforming on the patterns. Compared with conventional photolithographic and etching technologies, direct-write micro-patterns of ITO using Nd:YVO4 laser at proper control can achieve high quality of surface without requiring numerous processing steps. Using diffractive multiple Nd:YVO4 beam, the ITO thin film could be removed without any damage to the glass structure. After laser patterning, a high overlapping area of laser spot was used to pattern the electrode layer on film surface for obtaining a fine ablated edge profile. Accordingly, the micro parts can be obtained using electroforming and release process via laser-patterned ITO films. The new micro parts processing is a maskless, dry and low-cost process instead of the complex photolithography, sputtering and sacrificial layer.
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