氮化铟薄膜的形貌和结构

C.P. Foley , T.L. Tansley
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引用次数: 18

摘要

用x射线衍射仪(XRD)和扫描电镜(SEM)研究了在活性氮等离子体中射频溅射制备半导体氮化铟的过程。与先前的报道相反,观察到目标表面的渐进氮化[1],并发现控制膜形态和生长速度。由完全氮化的靶制备的样品完全是c轴取向和多晶的,而当靶氮化不完全时,其他纤锌矿平面仍然存在。这里涉及的目标过程要求在靠近目标的射频放电区域,原子氮的分压为10−4 Torr。表面迁移过程也取决于目标状态。这些现象在结构带模型[2]的背景下进行分析,同时考虑了晶体生长习惯的统一方法[3]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Morphology and structure of indium nitride films

Growth processes of semiconducting indium nitride prepared by radiofrequency sputtering of a metallic target in a reactive nitrogen plasma have been studied by X-ray diffraction (XRD) and scanning electron microscopy (SEM). Contrary to previous reports progressive nitridation of the target surface is observed [1] and is found to control film morphology and growth rate. Samples prepared from fully nitrided targets are exclusively c-axis oriented and polycrystalline, while other wurtzite planes persist when target nitridation is incomplete. The target process involved here requires the partial pressure of atomic nitrogen to be 10−4 Torr in the RF discharge region close to the target. Surface migration processes are also dependent on the target state. These phenomena are analyzed within the context of the structure zone model [2] while considering a unified approach to crystal growth habit [3].

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