{"title":"基于SU-8模具的微流控芯片的制备","authors":"Yuanqing Wu, Su-Ying Yao","doi":"10.1109/EDSSC.2011.6117676","DOIUrl":null,"url":null,"abstract":"As the silicon mold has rough edges, microchip is not conducive to fluid movement. In this paper, mold was produced by SU-8, and a set of production process was given. Then this paper made anti-stick layer on the mold, in order to improve mold re-use rate. Author discussed the impact of curing temperature and the ratio of PDMS and curing agent on the device, and does modification on casting PDMS, then seal to complete the microarray.","PeriodicalId":6363,"journal":{"name":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","volume":"27 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Preparation of micro fluidic chip based on SU-8 mold\",\"authors\":\"Yuanqing Wu, Su-Ying Yao\",\"doi\":\"10.1109/EDSSC.2011.6117676\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the silicon mold has rough edges, microchip is not conducive to fluid movement. In this paper, mold was produced by SU-8, and a set of production process was given. Then this paper made anti-stick layer on the mold, in order to improve mold re-use rate. Author discussed the impact of curing temperature and the ratio of PDMS and curing agent on the device, and does modification on casting PDMS, then seal to complete the microarray.\",\"PeriodicalId\":6363,\"journal\":{\"name\":\"2011 IEEE International Conference of Electron Devices and Solid-State Circuits\",\"volume\":\"27 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Conference of Electron Devices and Solid-State Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDSSC.2011.6117676\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2011.6117676","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Preparation of micro fluidic chip based on SU-8 mold
As the silicon mold has rough edges, microchip is not conducive to fluid movement. In this paper, mold was produced by SU-8, and a set of production process was given. Then this paper made anti-stick layer on the mold, in order to improve mold re-use rate. Author discussed the impact of curing temperature and the ratio of PDMS and curing agent on the device, and does modification on casting PDMS, then seal to complete the microarray.
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